The papers included in this leading international conference examine test structures for microelectronic devices, their recent progress and future directions. Included is a detailed treatment of current developments in microelectronic test structure research, implementation, and applications. Also addressed are advances in device characterization, such as increased miniaturization, reduced operating voltages and reduced power requirements through improved measurement and test techniques. Topics highlighted include: Process Characterization, Dimensional Measurements, Interconnection, Material Characterization, Reliability, Device Characterization, and Statistics. Lasers; Bulk Crystals; Epitaxy; HFETs; Selective Growth; Photodetectors; Electron Devices; Optoelectronics and Processing; Novel Etching Techniques; HBTs; Interfaces and Contacts; Photonic Integration; MBE Growth and Related Techniques; Reliability and Passivation Techniques; MOVPE Growth and Related Techniques; Nanostructure Devices and Characterization"~"Circuits and Devices (General/Other)
