Thanks to increasing power consumption and component density, localized "hot spots" are becoming a serious challenge in IC (integrated circuit) chip design - so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this groundbreaking technology. After reviewing cooling principles and current bulk cooling methods, the book brings engineers up to speed on emerging droplet-based architectures. Amply illustrated, this milestone work will prove invaluable in tackling IC heat issues that existing methods can no longer address.
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About the Author
Philip Y. Paik is a microfluids design engineer at Advanced Liquid Logic, Inc., in North Carolina. He received his Ph.D. in electrical engineering from Duke University. Vamsee K. Pamula is co-founder and vice president of Advanced Liquid Logic, Inc. in North Carolina. A member of IEEE, he earned his Ph.D. in electrical engineering at Duke University. Krishnendu Chakrabarty is associate professor in the Department of Electrical and Computer Engineering at Duke University, North Carolina. He is the author or coauthor of six books in the IC field, hehas contributed chapters to 13 additional works, and he has published over 200 technical papers. He received his Ph.D. in computer science and engineering from the University of Michigan.
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Inside This Book
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using digital microfluidics, digital microfluidic chip, digital microfluidic devices, thermal conductance layer, adaptive cooling, hot spot power densities, grounding rails, digital microfluidic platform, digital microfluidic system, background heat flux, droplet transport, ability for droplets, filler fluid, silicon heater, droplet dispensing, mercury droplet, actuation voltages, residence frequency, lead wire resistance, square electrodes, heat transfer experiments, microfluidic chips, transport electrodes, droplet motion, heat flux density Key Phrases - Capitalized Phrases (CAPs): (learn more)
Flow-Through-Based Adaptive Cooling, Technology Development, International Conference, Thermal Management of Integrated Circuits, Programmable Thermal Switch Based Adaptive Cooling, Proceedings of the International Symposium, Thermal Effects of Digital Microfluidic Devices, Hot-Spot Power Density, Design Automation, Dry Film Soldermask Thickness, Fabrication Parameter, Electronic Systems, Board Thickness, Thermomechanical Phenomena, Electrode Spacing, Applied Physics Letters, Final Copper Thickness, Initial Copper Thickness Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Surprise Me!
using digital microfluidics, digital microfluidic chip, digital microfluidic devices, thermal conductance layer, adaptive cooling, hot spot power densities, grounding rails, digital microfluidic platform, digital microfluidic system, background heat flux, droplet transport, ability for droplets, filler fluid, silicon heater, droplet dispensing, mercury droplet, actuation voltages, residence frequency, lead wire resistance, square electrodes, heat transfer experiments, microfluidic chips, transport electrodes, droplet motion, heat flux density Key Phrases - Capitalized Phrases (CAPs): (learn more)
Flow-Through-Based Adaptive Cooling, Technology Development, International Conference, Thermal Management of Integrated Circuits, Programmable Thermal Switch Based Adaptive Cooling, Proceedings of the International Symposium, Thermal Effects of Digital Microfluidic Devices, Hot-Spot Power Density, Design Automation, Dry Film Soldermask Thickness, Fabrication Parameter, Electronic Systems, Board Thickness, Thermomechanical Phenomena, Electrode Spacing, Applied Physics Letters, Final Copper Thickness, Initial Copper Thickness Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Surprise Me!
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