Advanced Electronic Packaging: With Emphasis on Multichip Modules (IEEE Press Series on Microelectronic Systems) [Hardcover]

William D. Brown (Editor)

Book Description

ISBN-10: 0780347005 | ISBN-13: 978-0780347007 | Publication Date: October 13, 1998 | Edition: 1

Packaging is rapidly becoming an area of microeclectronics technology which can limit the operating speed on an integrated circuit. To address this concern, much research and development attention now focuses on packaging in an effort to prevent it from impeding the speed of electronic systems.

With Advanced Electronic Packaging, readers can learn about the full range of packaging concepts, from the introductory to the advanced level, and gain a deeper understanding of this rapidly growing area of microelectronics.

As an excellent desk reference for practicing engineers or as an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the fabrication, testing, reliability, and packaging of integrated circuits, specifically, multichip modules (MCM). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design tradeoffs. Also addressed are the critical role of economics and future trends in electronic packaging.

An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

Editorial Reviews

From the Back Cover

Electrical Engineering Advanced Electronic Packaging With Emphasis on Multichip Modules Packaging is rapidly becoming an area of microelectronics technology that can limit the operating speed on an integrated circuit. To address this concern, much research and development attention now focuses on packaging in an effort to prevent it from impeding the speed of electronic systems. With Advanced Electronic Packaging, readers can learn about the full range of packaging concepts, from the introductory to the advanced level, and gain a deeper understanding of this rapidly growing area of microelectronics. An excellent desk reference for practicing engineers or an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the packaging of integrated circuits, specifically, multichip modules (MCMs). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design trade offs. Also addressed are the critical role of economics and future trends in electronic packaging.

About the Author

About the Editor William D. Brown is the associate dean for research in the College of Engineering and a professor in the Department of Electrical Engineering at the University of Arkansas. Since 1991, he has been actively involved with the High Density Electronics Center (HiDEC) at the University of Arkansas--a center dedicated to advancing the state of the art of electronic packaging materials and technologies--in particular, multichip module technologies. Dr. Brown currently serves on the Executive Committee of the Board of Directors of the Electrochemical Society. In 1996, he received the Thomas D. Callinan Award by the Dielectric Science and Technology Division of the Electrochemical Society in recognition of outstanding contributions to the chemistry and physics of dielectric materials. He has published over 180 technical journal and proceedings articles, has contributed to eight books, and holds four U.S. patents. His research interests include electronic packaging technology; semiconductor materials (focusing on dielectrics) and devices; and solid-state and semiconductor physics. He holds memberships in IEEE, IMAPS, AVA, MRS, and ASEE.

Product Details

• Hardcover: 784 pages
• Publisher: Wiley-IEEE Press; 1 edition (October 13, 1998)
• Language: English
• ISBN-10: 0780347005
• ISBN-13: 978-0780347007
• Product Dimensions: 10.4 x 7.4 x 2 inches
• Shipping Weight: 3.5 pounds (View shipping rates and policies)
• Average Customer Review: 5.0 out of 5 stars  See all reviews (1 customer review)
• Amazon Best Sellers Rank: #3,488,979 in Books (See Top 100 in Books)

Customer Reviews

Most Helpful Customer Reviews

0 of 2 people found the following review helpful:

5.0 out of 5 stars A book for everyone from a Novice to an Expert., August 28, 2000

By A Customer

This review is from: Advanced Electronic Packaging: With Emphasis on Multichip Modules (IEEE Press Series on Microelectronic Systems) (Hardcover)

I am a student of Dr. Brown. I must emphasize that the book that he has edited and a part of which he has written, is just excellent in its quality and quantity. By quality I mean its the best book on packaging that I have read and by quantity I mean the book has something on everything. Most of the books are like a lot on a topic and very less on most of the other topics, but this book surpasses everything. It treats every chapter fairly and equally. The book will not make one an expert in packaging, but would surely make one fell satisfied with the content and knowledge. I hope that other readers too would find this book good and informative.