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Air Cooling Technology for Electronic Equipment
 
 
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Air Cooling Technology for Electronic Equipment [Hardcover]

Sung Jin Kim (Author), Sang Woo Lee (Author)
3.0 out of 5 stars  See all reviews (1 customer review)


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Book Description

0849394473 978-0849394478 June 30, 1996 1
Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics.

Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling?

The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.

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Product Details

  • Hardcover: 272 pages
  • Publisher: CRC-Press; 1 edition (June 30, 1996)
  • Language: English
  • ISBN-10: 0849394473
  • ISBN-13: 978-0849394478
  • Product Dimensions: 9.6 x 6.4 x 0.8 inches
  • Shipping Weight: 1.3 pounds
  • Average Customer Review: 3.0 out of 5 stars  See all reviews (1 customer review)
  • Amazon Best Sellers Rank: #2,584,782 in Books (See Top 100 in Books)

 

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2 of 2 people found the following review helpful:
3.0 out of 5 stars A mixture of technical & understandable information, September 12, 2000
By 
Adam S. Sharp (Sellersville, PA United States) - See all my reviews
(REAL NAME)   
This review is from: Air Cooling Technology for Electronic Equipment (Hardcover)
This book is a fairly useful resource for those interested in air cooling. Although it put me to sleep, there is some pretty good information. The six chapters were each composed by a different person or group and thus each have different technical content. The first few chapters contain a lot of technical information and require a very strong mathematical background to fully comprehend. These chapters can still yield some basic helpful information with a cursory read. Some of the other chapters leave the equations out of it and convey some beneficial in a 'rule of thumb' sort of way. Overall, I found it dry but beneficial. I believe it would be even more helpful to those involved in circuit board cooling.
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Inside This Book (learn more)
First Sentence:
In the design of packages of electronic components there are strong incentives to mount as much circuity as possible in a given space. Read the first page
Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
adiabatic heat transfer coefficient, thermal wake effect, board conductivity, board conduction, jet impingement heat transfer, discrete heat sources, board thermal conductivity, thermofoil heater, pressure drop number, overall thermal conductance, pressure drop coefficient, conjugate heat transfer, direct air cooling, heat transfer enhancement, flow reattachment, convection air cooling, developed channel flow, turbulent forced convection, wake function, laminar boundary layer flow, streamwise position, circuit packs, rectangular source, conjugate problem, substrate conduction
Key Phrases - Capitalized Phrases (CAPs): (learn more)
Air Cooling Technology, Heat Mass Transfer, New York, Souza Mendes, Heat Fluid Flow, Fluid Mech, Fluids Eng, John Wiley, University of Arizona, Machine Design, Penton Publication, Stanford University, Van Nostrand Reinhold
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