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Ambient Intelligence with Microsystems: Augmented Materials and Smart Objects
 
 
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Ambient Intelligence with Microsystems: Augmented Materials and Smart Objects [Hardcover]

Kieran Delaney (Editor)

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Book Description

0387462635 978-0387462639 October 23, 2008 1

Augmented Materials and Smart Objects investigates the issues required to ensure technology platforms capable of being seamlessly integrated into everyday objects. In particular, it deals with the requirements for integrated computation and MEMs sensors, system-in-a-package solutions, and multi-chip modules. On top of this, the publication’s 500 pages cover the impact of the trend towards embedded microelectronic electronics sub-systems, novel assembly techniques for autonomous MEMs sensors, and practical performance issues that are key to the AmI concept.


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From the Back Cover

Ambient Intelligence with Microsystems: Augmented Materials and Smart Objects

This text investigates relationships that Ambient Intelligence has with current and emerging Microsystems

Ambient Intelligence conceptualizes systems that are proactive, context-aware and unobtrusive. Microsystems enable these systems to be seamlessly integrated into everyday objects.

This work examines the opportunities and challenges in using integrated computing with MEMs sensors. It evaluates the impact of trends towards embedded sub-systems, including System-in-a-Package solutions, as well as rapidly growing areas of research, such as wireless sensor networks.

Methods for realizing smart objects are discussed, including smart textiles, intelligent surfaces, smart tracking and environmental monitoring systems, This provides for an infrastructure of heterogeneous systems attached to (or physically embedded in) everyday objects that enable collections of smart objects to collaborate and provide services.

Technical barriers are discussed as well as methods to meet the challenges of what is a strongly collaborative process. Co-design is integral to this; for optimal results the goal must be co-innovation, with the needs of key stakeholders recognised and addressed.

Ambient Intelligence with Microsystems: Augmented Materials and Smart Objects discusses the vision statements relevant to future embedded sensor platforms for smart objects and, ultimately, Ambient Intelligence.

Readers will find up to-date research in Ambient Intelligence and in Microsystems including;

  • A practical approach to realizing concepts within Ambient Intelligence, including new heterogeneous systems infrastructures and international R&D programs
  • Analyses of embedded microelectronic sub-systems and novel assembly techniques for autonomous MEMs sensors.
  • Reviews of initiatives in collaborative research that are leading to innovation in hardware, networking and software, including the effect of whole-systems methodologies

Ambient Intelligence with Microsystems: Augmented Materials and Smart Objects is written for researchers and professionals in the areas of microsystems, smart materials, ambient and pervasive systems, and those investigating and exploiting wireless sensor networks.


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Inside This Book (learn more)
Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
pervasive computing, smart dust, sensor networks, disappearing computer, ubiquitous computing, container tracking system, pervasive environments, extrovert gadgets, wearable computers, smart systems, communication module, load sensing, ambient ecologies, future smart systems, ambient ecology, embedded wireless networks, augmented materials, energy harvesting device, embedded systems research, energy harvesting techniques, actuator platforms, gold stud bumps, energy scavenging, cooperating objects, pervasive computing systems
Key Phrases - Capitalized Phrases (CAPs): (learn more)
International Conference, Information Processing, Augmenting Materials, Power Management, Build Cooperating Objects, Tyndall National Institute, Overview of Component Level Devices, Enterprise Ireland, Jung Fig, San Diego, Cork Institute of Technology, New York, Moore's Law, International Workshop, Special Issue, Year of Publication, Embedded Microelectronic Subsystems, John Wiley, Smart Table, Embedded Networked Sensor Systems, Science Foundation Ireland, United States, Advanced Packaging, Computer Science, University of California
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Front Cover | Table of Contents | First Pages | Index | Surprise Me!
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