This text covers ball grid array (BGA) design and manufacturing. BGA is a relatively new way of connecting leads from an integrated circuit package to a printed circuit board, allowing a higher pin count and function density than other connection methods and giving the lowest signal delay. These features make it an important component of modern high performance systems, but the density of leads makes manufacturing and process control very difficult.
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Book Description
Editorial Reviews
About the Author
John H. Lau received his Ph.D. degree in Theoretical and Applied Mechanics from the University of Illinois (1977), a M.A.Sc. degree in Structural Engineering from the University of British Columbia (1973), a second M.S. degree in Engineering Physics from the University of Wisconsin (1974), and a third M.S. degree in Management Science from Fairleigh Dickinson University (1981). He also has a B.E. degree in Civil Engineering from National Taiwan University (1970). John is an interconnection technology scientist at Agilent Technologies, Inc. His current interests cover a broad range of electronic and optoelectronic packaging and manufacturing technology. Prior to Agilent, he worked for Express Packaging Systems, Hewlett-Packard Company, Sandia National Laboratory, Bechtel Power Corporation, and Exxon Production and Research Company. With more than 30 years of R&D and manufacturing experience in the electronics, petroleum, nuclear, and defense industries, he has given over 200 workshops, authored and co-authored over 180 peer reviewed technical publications, and is the author and editor of 13 books: Solder Joint Reliability; Handbook of Tape Automated Bonding; Thermal Stress and Strain in Microelectronics Packaging; The Mechanics of Solder Alloy Interconnects; Handbook of Fine Pitch Surface Mount Technology; Chip On Board Technologies for Multichip Modules; Ball Grid Array Technology; Flip Chip Technologies; Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies; Electronics Packaging: Design, Materials, Process, and Reliability; Chip Scale Package (CSP): Design, Materials, Process, Reliability, and Applications; Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies, and Microvias for Low Cost, High Density Interconnects. John served as one of the associate editors of the IEEE Transactions on Components, Packaging, and Manufacturing Technology and ASME Transactions, Journal of Electronic Packaging. He also served as general chairman, program chairman, and session chairman, and invited speaker of several IEEE, ASME, ASM, MRS, IMAPS, SEMI, and SMI International conferences. He received a few awards from ASME and IEEE for best papers and outstanding technical achievements, and is an ASME Fellow and an IEEE Fellow. He is listed in American Men and Women of Science and Who’s Who in America.
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Most Helpful Customer Reviews
2 of 3 people found the following review helpful:
5.0 out of 5 stars
Superb book on BGA technology,
By Clavius Chin "cclavius" (Singapore) - See all my reviews
This review is from: Ball Grid Array Technology (Hardcover)
This book is one of "THE" book that would certainly excite you and glue your eyes to it. A definite recommendation to anyone who wants to know more about BGAs. An all round coverage on PBGA, CBGA, TBGA, CCGA - their design, process parameters, inspection, reliability and rework. Everyone who started browsing this book just couldn't let go. Nonetheless, I think the author should further elaborate on how to inspect the BGAs, like the sample preparation parameters needed to produce a good microsection sample for each types of BGAs, the passing criteria for each of the inspection parameter, more photos on each means of inspections showing the defects, etc.
4.0 out of 5 stars
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This review is from: Ball Grid Array Technology (Hardcover)
that is for the first time I purchased a used book, and I was impressed, its condition was great. So for the next time used books will be on my shopping list.
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Inside This Book
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First Sentence:
The electronics industry is one of the most fascinating, dynamic, and important industries. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
die attach region, card pad diameter, eutectic fillet, solder joint array, solder strain, viscoplastic strain energy density, popcorn failure, terminal solder pads, individual solder joints, memory controller modules, wire bond fingers, thermal performance curves, popcorn cracking, solder ball connect, package delamination, thermal vias, nominal shear strain, pad array carrier, characteristic crack length, module pad, test fault coverage, thermal cycle conditions, paste screening, gold embrittlement, plastic ball grid array packages Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Van Nostrand Reinhold, Technology Conference, International Business Machines, International Conference, Circuit World, International Symposium, San Jose, Citizen Watch, Manufacturing Technology, Slightly Larger, Circuits Assembly, Electrochemical Publications, Electronic Engineering Times, Tape Carrier Package, Advancing Microelectronics, International Electronics Packaging Conference, Microelectronics Packaging Handbook, Multi-Chip Modules, San Diego, Solid State Technology, Thin Small Outline Package, Kluwer Academic Publishers, Military Standard, Mitsubishi Gas Chemical New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
The electronics industry is one of the most fascinating, dynamic, and important industries. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
die attach region, card pad diameter, eutectic fillet, solder joint array, solder strain, viscoplastic strain energy density, popcorn failure, terminal solder pads, individual solder joints, memory controller modules, wire bond fingers, thermal performance curves, popcorn cracking, solder ball connect, package delamination, thermal vias, nominal shear strain, pad array carrier, characteristic crack length, module pad, test fault coverage, thermal cycle conditions, paste screening, gold embrittlement, plastic ball grid array packages Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Van Nostrand Reinhold, Technology Conference, International Business Machines, International Conference, Circuit World, International Symposium, San Jose, Citizen Watch, Manufacturing Technology, Slightly Larger, Circuits Assembly, Electrochemical Publications, Electronic Engineering Times, Tape Carrier Package, Advancing Microelectronics, International Electronics Packaging Conference, Microelectronics Packaging Handbook, Multi-Chip Modules, San Diego, Solid State Technology, Thin Small Outline Package, Kluwer Academic Publishers, Military Standard, Mitsubishi Gas Chemical New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
This book cites 57
books:
See all 57 books this book cites
35
books
cite this book:
See all 35 books citing this book
- Microelectronics Packaging Handbook by R.R. Tummala on 5 pages
- Handbook Of Fine Pitch Surface Mount Technology (Electrical Engineering) by John H. Lau on 4 pages
- Handbook Of Tape Automated Bonding by John H. Lau on 4 pages
- Principles of Electronic Packaging by Donald Seraphim on page 57, page 221, and Back Matter
- Solder Joint Reliability: Theory and applications by John H. Lau on page 58, and Back Matter
See all 57 books this book cites
- Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies by John H. Lau on 11 pages
- Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies by John H. Lau on 7 pages
- Microvias: For Low Cost, High Density Interconnects by John H. Lau on 5 pages
- Chip Scale Package: Design, Materials, Process, Reliability, and Applications by John H. Lau on 5 pages
- Electronic Assembly Fabrication by Charles Harper in Front Matter, and page 189
See all 35 books citing this book
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