Based upon practical experience, it treats the entire joining technology in the electronics production cycle as it relates to soldering--including cleaning, statistical quality control, through-hole and S M joining. Promotes an understanding of the complex interrelations of various process parameters to lead readers to an analysis and resolution of this manufacturing procedure.
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Based upon practical experience, it treats the entire joining technology in the electronics production cycle as it relates to soldering--including cleaning, statistical quality control, through-hole and S M joining. Promotes an understanding of the complex interrelations of various process parameters to lead readers to an analysis and resolution of this manufacturing procedure.
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Inside This Book
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First Sentence:
Soldering is an old art, yet a rather recent science. Read the first page Key Phrases - Capitalized Phrases (CAPs): (learn more)
United States, Montreal Protocol, Hoechst Kaltron, Courtesy of Hollis, Courtesy of Research Inc, None None, North American, Selected List, Courtesy of Vanzetti Systems, Great Britain, Kali-Chemie Arklone, Courtesy of Novastar, Courtesy of Vitronics, Kali-Chemie Flugene, Nepcon West, Proceedings of the Technical Program, Solder Balls Appearance, Solder Balls Description New!
Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Soldering is an old art, yet a rather recent science. Read the first page Key Phrases - Capitalized Phrases (CAPs): (learn more)
United States, Montreal Protocol, Hoechst Kaltron, Courtesy of Hollis, Courtesy of Research Inc, None None, North American, Selected List, Courtesy of Vanzetti Systems, Great Britain, Kali-Chemie Arklone, Courtesy of Novastar, Courtesy of Vitronics, Kali-Chemie Flugene, Nepcon West, Proceedings of the Technical Program, Solder Balls Appearance, Solder Balls Description New!
Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
5
books
cite this book:
- High Temperature Electronics (Electronic Packaging) by Patrick McCluskey in Back Matter
- Manufacturing: Design, Production, Automation, and Integration (Manufacturing Engineering and Materials Processing) by Beno Benhabib on page 360
- Reliability and Failure of Electronic Materials and Devices by Milton Ohring on page 471
- Combat Robots Complete : Everything You Need to Build, Compete, and Win by Chris Hannold on page 263
- Joining of Materials and Structures: From Pragmatic Process to Enabling Technology by Robert W. Messler on page 449
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