Chemical Mechanical Planarization of Microelectronic Materials [Hardcover]

Joseph M. Steigerwald (Author), Shyam P. Murarka (Author), Ronald J. Gutmann (Author)

Book Description

Publication Date: February 10, 1997 | ISBN-10: 0471138274 | ISBN-13: 978-0471138273 | Edition: 1

Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now.

Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP.

The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry.

An indispensable resource for scientists and engineers working in the microelectronics industry

Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including:

• The history of CMP
• Chemical and mechanical underpinnings of CMP
• CMP materials and processes
• Applications of CMP in the microelectronics industry
• The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication
• Post-CMP cleaning techniques
• Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP

Editorial Reviews

From the Publisher

This succinct reference/textbook deals with chemical and polishing techniques for electronic materials. Explains how to use the chemical mechanical planarization (CMP) process to improve the electronic properties of such substances as tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers. The first section covers the scientific fundamentals of CMP, followed by a detailed discussion of principal applications. Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.

From the Back Cover

Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now.

Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP.

The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry.

An indispensable resource for scientists and engineers working in the microelectronics industry

Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including:
* The history of CMP
* Chemical and mechanical underpinnings of CMP
* CMP materials and processes
* Applications of CMP in the microelectronics industry
* The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication
* Post-CMP cleaning techniques
* Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.

See all Editorial Reviews

Product Details

• Hardcover: 337 pages
• Publisher: Wiley-VCH; 1 edition (February 10, 1997)
• Language: English
• ISBN-10: 0471138274
• ISBN-13: 978-0471138273
• Product Dimensions: 8.8 x 6.6 x 0.8 inches
• Shipping Weight: 1.7 pounds (View shipping rates and policies)
• Average Customer Review: 2.0 out of 5 stars  See all reviews (2 customer reviews)
• Amazon Best Sellers Rank: #2,107,976 in Books (See Top 100 in Books)

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Customer Reviews

Most Helpful Customer Reviews

5 of 5 people found the following review helpful:

1.0 out of 5 stars Surprisingly bad, September 10, 2002

By A Customer

This review is from: Chemical Mechanical Planarization of Microelectronic Materials (Hardcover)

There are so many errors in this book that I cannot imagine how can anybody rely on any information contained here. The book is probably simply showing the current understanding of CMP, which is poor, but this still cannot justify bluntly bad science. The authors describe all important concepts of CMP like Preston equation, Pourbaix diagrams, but fail to clearly show the limited scope of their usefulness. They do not understand thermodynamics vs. kinetics of chemical processes either. At least half of the chemical equations are wrong, another quarter should not be there in the form presented. Who reviewed this book before publishing?

5 of 6 people found the following review helpful:

3.0 out of 5 stars Not a very good one, April 17, 2000

By A Customer

This review is from: Chemical Mechanical Planarization of Microelectronic Materials (Hardcover)

This area is short of research even though lots of work has been done. This book gives an overview of CMP process, including Cu, W and SiO2.