Chemical Mechanical Planarization of Semiconductor Materials [Hardcover]

M.R. Oliver (Editor)

Book Description

Publication Date: March 19, 2004 | ISBN-10: 3540431810 | ISBN-13: 978-3540431817 | Edition: 1

This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Editorial Reviews

From the Back Cover

This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Product Details

• Hardcover: 436 pages
• Publisher: Springer; 1 edition (March 19, 2004)
• Language: English
• ISBN-10: 3540431810
• ISBN-13: 978-3540431817
• Product Dimensions: 9.4 x 6.3 x 1.2 inches
• Shipping Weight: 2.2 pounds (View shipping rates and policies)
• Average Customer Review: 5.0 out of 5 stars  See all reviews (1 customer review)
• Amazon Best Sellers Rank: #482,380 in Books (See Top 100 in Books)

Customer Reviews

Most Helpful Customer Reviews

5 of 6 people found the following review helpful:

5.0 out of 5 stars CMP: An Overview, May 24, 2005

By 

Ed Paul (Stockton College, Pomona NJ. USA) - See all my reviews

This review is from: Chemical Mechanical Planarization of Semiconductor Materials (Hardcover)

This is an outstanding book. It provides an overview of the current status of CMP and serves as a significant update to Steigerwald's 1997 book, which summarized the state of CMP knowledge (which began for electronic applications in 1991)at that time. Much has happened in the second half of CMP's existence.

The book is well edited by Mike Oliver. It includes chapters written by well known CMP specialists that focus on process aspects (technology, equipment, pads, cleaning), on metals (theory and applications), on slurries, and on patterned wafers. It also provides chapters with overviews of CMP. Each chapter has extensive references.

The individual chapters are carefully written to offer an introduction and broad perspectives to new CMP workers while providing depth of insight and material for experienced practitioners. This is an ideal book for advanced undergraduates and graduate students who are working in the field and for those who are starting to do planarization of semiconductor materials. It is also an ideal reference book for experienced polishers since it gives information about the process at a level that is useful and insightful.

I have found the book very useful to me both for its clear summaries of material that I already know about and for its helpful explanations of areas that I am not familiar with. I highly recommend it.