Chip Scale Package: Design, Materials, Process, Reliability, and Applications [Hardcover]

John H. Lau (Author), Ricky S.W. Lee (Author), S.W. Ricky Lee (Author)

Book Description

ISBN-10: 0070383049 | ISBN-13: 978-0070383043 | Publication Date: February 28, 1999 | Edition: 1

The first comprehensive, in-depth guide to chip scale packaging, this reference gives you cutting-edge information on the most important new development in electronic packaging since surface mount technology (SMT). Featuring the latest design techniques, plus details on more than 40 different types of CSP, Chip Scale Package hands engineers and designers the complete, professional set of working tools that they need to solve technical and design issues; find the most efficient, cost-effective CSP solutions for their deployments; answer questions on interfacing, speed, robustness, and more; compare properties of wirebonds, flip chips, rigid and flex substrates, wafer-level redistribution, and other CSP products; get the latest information on new offerings from Fujitsu, GE, Hitachi, IBM, Matushita, Motorola, National Semiconductor, NEC, Sharp, Sony, Toshiba, Amkor, TT, LG Semicon, Mitsubishi, Shell Case, Tessera, Samsung, and other major companies; and learn about CSP products under development. A revolution in electronics, CSP is taking the electronics industry by storm. Page after page, this standard-setting guide gives you both essential technical details and an eye-opening overview of this fast-developing field. No matter how you use Chip Scale Package, youÕll see why itÕs the resource of choice for those who want to be at the top of the game.

Editorial Reviews

From the Back Cover

The first comprehensive, in-depth guide to chip scale packaging (CSP), this reference gives you cutting-edge information on the most important new development in electronic packaging since surface mount technology (SMT). Featuring the latest design techniques, plus details on more than 40 different types of CSP, hands engineers and designers the complete, professional set of working tools to: solve technical and design issues; find the most efficient, cost-effective CSP solutions for deployments; answer questions on interfacing, speed, robustness, and more; compare properties of wirebonds, flip charts, rigid and flex substrates, wafer-level redistribution, and other CSP products; get the latest information on new offerings from Fujitsu, GE, Hitachi, IBM, Mitsubishi, TI, Amkor, LG Semicon, Tessera, Samsung, Shell Case, Matushita, Motorola, National Semiconductor, NEC, Sharp, Sony, Toshiba, and other major companies; learn about CPS products under development. A revolution in electronics, CSP is taking the electronics industry by storm. Page after page, this standard-setting guide gives you both essential technical detials and an eye-opening overview of this fast-developing field. No matter how you use Chip Scale Package, you'll see why it's the resource of choice for those who want to be at the top of the game.

About the Author

John H. Lau is president of Express Packaging Systems, Inc., and one of the foremost educators on electronic packaging worldwide. He and his company are based in Palo Alto, California. S-W. Ricky Lee is a widely known expert and lecturer on electronic packaging. He is a mechanical engineering faculty member at Hong Kong University of Science and Technology.

Product Details

• Hardcover: 564 pages
• Publisher: McGraw-Hill Professional; 1 edition (February 28, 1999)
• Language: English
• ISBN-10: 0070383049
• ISBN-13: 978-0070383043
• Product Dimensions: 9.1 x 5.6 x 1.6 inches
• Shipping Weight: 2.4 pounds
• Average Customer Review: 4.0 out of 5 stars  See all reviews (1 customer review)
• Amazon Best Sellers Rank: #2,139,879 in Books (See Top 100 in Books)

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Customer Reviews

Most Helpful Customer Reviews

6 of 6 people found the following review helpful:

4.0 out of 5 stars An Excellent Handbook for Chip Scale Packages, April 9, 2000

By 

Yan Chien Chun (Hong Kong) - See all my reviews

This review is from: Chip Scale Package: Design, Materials, Process, Reliability, and Applications (Hardcover)

From this book, I learned many useful and interesting concepts of CSP design from companies around the world. Based on the strength of existing manufacturing capability, different companies implemented their CSP products in various ways. Some companies developed their CSPs using custom-designed lead frames. This type of CSPs may be stacked up to build 3-D modules. Due to the outstanding routing capability of flexible circuit, many companies used the flexible substrate as the interposer of their CSPs. This category has the most diversified package configurations. Based on the BGA technologies, CSPs with rigid substrate is a very popular CSP option in the packaging industry. Both organic and ceramic substrates are adopted. At the end of this book, several CSPs with wafer-level redistribution are introduced. This technology represents a new concept to package the whole wafer instead of each individual die. For each CSP introduced in this book, comprehensive descriptions are given to provide information on design concepts, package structures, materials consideration, and manufacturing process. Besides, the thermal/electrical performance and reliability testing results are evaluated and discussed. I enjoyed this book a lot and found it very useful to my research work. For packaging engineers who are working on CSPs, I believe this book can help them with further CSP design and modification.