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Chip Scale Package: Design, Materials, Process, Reliability, and Applications

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From this book, I learned many useful and interesting concepts of CSP design from companies around the world. Based on the strength of existing manufacturing capability, different companies implemented their CSP products in various ways. Some companies developed their CSPs using custom-designed lead frames. This type of CSPs may be stacked up to build 3-D modules. Due to the outstanding routing capability of flexible circuit, many companies used the flexible substrate as the interposer of their CSPs. This category has the most diversified package configurations. Based on the BGA technologies, CSPs with rigid substrate is a very popular CSP option in the packaging industry. Both organic and ceramic substrates are adopted. At the end of this book, several CSPs with wafer-level redistribution are introduced. This technology represents a new concept to package the whole wafer instead of each individual die. For each CSP introduced in this book, comprehensive descriptions are given to provide information on design concepts, package structures, materials consideration, and manufacturing process. Besides, the thermal/electrical performance and reliability testing results are evaluated and discussed. I enjoyed this book a lot and found it very useful to my research work. For packaging engineers who are working on CSPs, I believe this book can help them with further CSP design and modification.