This is the book version of a special issue of the "International Journal of High Speed Electronics and Systems", reviewing recent work in the field of compound semiconductor integrated circuits. There are 14 invited papers covering a wide range of applications, frequencies and materials. These papers deal with digital, analog, microwave and millimeter-wave technologies, devices and integrated circuits for wireline fiber-optic lightwave transmissions, and wireless radio-frequency microwave and millimeter-wave communications. In each case, the market is young and experiencing rapid growth for both commercial and millitary applications. Many new semiconductor technologies compete for these new markets, leading to an alphabet soup of semiconductor materials described in these papers. The book also includes three papers focused on radiation effects and reliability in III-V semiconductor electronics, which are useful for reference and future directions. Moreover, reliability is covered in several papers separately for certain process technologies.
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Readership: Engineers, scientists and graduate students working on high speed electronics and systems, and in the area of compound semiconductor integrated circuits.
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This paper describes state-of-the-art of high-speed electronic device and IC technologies for very high-speed lightwave communications systems. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
displacement damage effects, gate finger width, metamorphic devices, upset cross sections, chip micrograph, static frequency divider, distributed amplifier, donor passivation, recovered clock signal, transimpedance gain, proton damage, operating waveforms, fabrication run, fmax values, pattern jitter, modulator driver, input data signal, transimpedance amplifier, compound semiconductor devices, compound semiconductor technologies, total dose effects, single event effects, lumped amplifier, upset sensitivity, limiting amplifier Key Phrases - Capitalized Phrases (CAPs): (learn more)
Solid-State Circuits, World Scientific Publishing Company, Solid-State Circuit Conf, Tech Papers, Technical Digest, Electron Device Letters, Circuit Design Figure, Eiichi Sano, High Speed Electron, International Microwave Symposium Digest, New York, Solid State Circuits, Digest of Technical Papers, Hiroki Nakajima, International Conference, Mayo Foundation, Microwave Theory Tech, Shoji Yamahata, Device Mode, Digest of Papers, Eiji Ohue, Electronics Letters, Hiromi Shimamoto, Katsuya Oda, Katsuyoshi Washio New!
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Front Cover | Front Flap | Table of Contents | First Pages | Back Flap | Back Cover | Surprise Me!
This paper describes state-of-the-art of high-speed electronic device and IC technologies for very high-speed lightwave communications systems. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
displacement damage effects, gate finger width, metamorphic devices, upset cross sections, chip micrograph, static frequency divider, distributed amplifier, donor passivation, recovered clock signal, transimpedance gain, proton damage, operating waveforms, fabrication run, fmax values, pattern jitter, modulator driver, input data signal, transimpedance amplifier, compound semiconductor devices, compound semiconductor technologies, total dose effects, single event effects, lumped amplifier, upset sensitivity, limiting amplifier Key Phrases - Capitalized Phrases (CAPs): (learn more)
Solid-State Circuits, World Scientific Publishing Company, Solid-State Circuit Conf, Tech Papers, Technical Digest, Electron Device Letters, Circuit Design Figure, Eiichi Sano, High Speed Electron, International Microwave Symposium Digest, New York, Solid State Circuits, Digest of Technical Papers, Hiroki Nakajima, International Conference, Mayo Foundation, Microwave Theory Tech, Shoji Yamahata, Device Mode, Digest of Papers, Eiji Ohue, Electronics Letters, Hiromi Shimamoto, Katsuya Oda, Katsuyoshi Washio New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Front Flap | Table of Contents | First Pages | Back Flap | Back Cover | Surprise Me!
Citations (learn more)
This book cites 22
books:
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- A30.5 Integrated Circuits Video by Thomson Delmar Learning in Front Matter, page 215, and page 218
- Digest of Technical Papers by IEEE International Pulsed Power Conference on page 261, and page 262
- Ultrafast Electronics and Optoelectronics (Ultrafast Electronics & Optoelectronics) by Lasers and Electro-Optics Society on page 25, and page 326
- Optical Communications (Proceedings SPIE--the International Society of Optical Engineering) by Bor-Uei Chen on page 168
- Quantum Dots (Selected Topics in Electronics and Systems) by E. Borovitskaya in Front Matter
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