Details infallible techniques for designing electronic hardware to withstand severe thermal environments. Using both SI and English units throughout, it presents methods for the development of various reliable electronic systems without the need of high-speed computers. It also offers mathematical modeling applications, using analog resistor networks, to provide the breakup of complex systems into numerous individual thermal resistors and nodes for those who prefer high-speed digital computer solutions to thermal problems.
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Details infallible techniques for designing electronic hardware to withstand severe thermal environments. Using both SI and English units throughout, it presents methods for the development of various reliable electronic systems without the need of high-speed computers. It also offers mathematical modeling applications, using analog resistor networks, to provide the breakup of complex systems into numerous individual thermal resistors and nodes for those who prefer high-speed digital computer solutions to thermal problems.
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12 of 15 people found the following review helpful:
3.0 out of 5 stars
Missing a lot for electronic packaging engineers,
By Yuri Kuzyk (Toronto, Ontario Canada) - See all my reviews
This review is from: Cooling Techniques for Electronic Equipment, 2nd Edition (Hardcover)
As a mechanical engineer who designs packaging for electronic equipment (telecommunications systems) I am rather disappointed in this book. There are basically two chapters that are useful while the rest are intended for aerospace applications. Fine, aerospace is a "sexier" application; but with the large number of engineers (ever growing) now looking at trying to keep 15W ASICs cool while avoiding EMC issues and/or manufacturing problems this book misses the boat.Anyone who has taken the TTI course (Dick Leatherman) or one of the other professional institutes around North America won't get anything from this textbook since it simply captures what's in your notes. For everyone else just wondering about this book - it isn't worth the money. The negatives: - the units (US imperial) are only useful in the US. The rest of the engineering world intelligently uses SI... - only two sections that are applicable to packaging engineering or other non-aerospace. - outdated technology. - no details on design fundamentals of cooling units (fans, blowers) - only two references to acoustic noise in the entire book! This is inexcusable for electronic equipment! - no discussion of integrating EMC solutions with thermal solutions. Not recommended unless you like shelfware...
4.0 out of 5 stars
Review - Cooling Techniques for Electronic Equipment, 2nd Edition,
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This review is from: Cooling Techniques for Electronic Equipment, 2nd Edition (Hardcover)
This book is nearly 20 years old and it is still the best reference for connecting the therory and practical examples.
4.0 out of 5 stars
Good reference book for engineers using and designing power electronic equipment,
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Amazon Verified Purchase(What's this?)
This review is from: Cooling Techniques for Electronic Equipment, 2nd Edition (Hardcover)
This book covers cooling of electronic equipment in depth. The best feature of the book is the completely worked out examples that Steinberg uses. The reader not only gets the equations, but also sees how they are applied in realistic examples. The only thing that I would have liked to see, but did not, was an example or two dealing more with the cooling of high powered semiconductors (such as the larger IGBTs).
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Inside This Book
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First Sentence:
Electronic equipment relies on the flow and control of electrical current to perform a fantastic variety of functions, in virtually every major industry throughout the world. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
circuit lamina, solder joint shear stress, cooling airflow rate, lead wire strain relief, plated throughholes, approximate fatigue life, component surface temperature, concentrated heat load, distributed heat load, wire bending stress, aluminum heat sink plate, fatigue cycle ratio, various altitude conditions, solder shear stress, temperature cycling range, electrical lead wires, mounting surface temperature, acceleration input level, component case temperature, cumulative fatigue damage ratio, throughhole mounting, uniform heat load, transformer lead wires, heat sink core, flow resistor network Key Phrases - Capitalized Phrases (CAPs): (learn more)
Tout Tin, Courtesy of Litton Systems Inc, Tav Pstd New!
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Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Electronic equipment relies on the flow and control of electrical current to perform a fantastic variety of functions, in virtually every major industry throughout the world. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
circuit lamina, solder joint shear stress, cooling airflow rate, lead wire strain relief, plated throughholes, approximate fatigue life, component surface temperature, concentrated heat load, distributed heat load, wire bending stress, aluminum heat sink plate, fatigue cycle ratio, various altitude conditions, solder shear stress, temperature cycling range, electrical lead wires, mounting surface temperature, acceleration input level, component case temperature, cumulative fatigue damage ratio, throughhole mounting, uniform heat load, transformer lead wires, heat sink core, flow resistor network Key Phrases - Capitalized Phrases (CAPs): (learn more)
Tout Tin, Courtesy of Litton Systems Inc, Tav Pstd New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
This book cites 11
books:
See all 11 books this book cites
15
books
cite this book:
See all 15 books citing this book
- Compact Heat Exchangers by W. M. Kays on page 169, page 215, and Back Matter
- Heat Transmission by William Henry McAdams on page 134, and Back Matter
- Preventing Thermal Cycling and Vibration Failures in Electronic Equipment by Dave S. Steinberg in Back Matter
- Fast Facts: Stress and Strain, second edition by James Campbell Quick in Back Matter
- Eshbach's Handbook of Engineering Fundamentals, 4th Edition by Byron D. Tapley in Back Matter
See all 11 books this book cites
- Heat Transfer In High Technology And Power Engineering by Yasuo Mori on page 154, and page 581
- Thermal Measurements in Electronics Cooling by Kaveh Azar on page 241, and page 347
- Encyclopedia of Microcomputers, Vol. 23 by Allen Kent on page 386
- Electronic Packaging: Design, Materials, Process, and Reliability by John H. Lau on page 191
- Passive Electronic Component Handbook by Charles A. Harper on page 747
See all 15 books citing this book
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