Start reading Low Dielectric Constant Materials for IC Applications: v. 9 on the free Kindle Reading App or on your Kindle in under a minute. Don't have a Kindle? Get your Kindle here.
Engineering & Transportation

Deliver to your Kindle or other device

Enter a promotion code
or gift card
 
 
 

Try it free

Sample the beginning of this book for free

Deliver to your Kindle or other device

Sorry, this item is not available in
Image not available for
Color:
Image not available

To view this video download Flash Player

 

Low Dielectric Constant Materials for IC Applications: v. 9 (Springer Series in Advanced Microelectronics) [Kindle Edition]

Paul S. Ho , Jihperng Leu , Wei William Lee

Digital List Price: $199.00 What's this?
Print List Price: $199.00
Kindle Price: $159.20
You Save: $39.80 (20%)

Free Kindle Reading App Anybody can read Kindle books—even without a Kindle device—with the FREE Kindle app for smartphones, tablets and computers.

To get the free app, enter your email address or mobile phone number.

Formats

Amazon Price New from Used from
Kindle Edition $159.20  
Hardcover $185.13  
Paperback $167.94  
Kindle Daily Deals
Kindle Delivers: Daily Deals
Subscribe to find out about each day's Kindle Daily Deals for adults and young readers. Learn more (U.S. customers only)

Book Description

Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.

Editorial Reviews

Review

From the reviews: Praise for P.S. Ho, J. Leu, and W.W. Lee, Ed's, Low Dielectric Constant Materials for IC Applications Electrical Insulation Magazine "Because this volume contains an excellent overview of the current research and issues with low-k dielectric materials for IC applications along with comprehensive practical information, researches, material scientists, and polymer engineers working in the area of microelectronics will find this book a very valuable addition to their library." "This text addresses the latest advances in low-k materials, thin film characterization, integration into copper interconnection processing, and reliability for microelectronics applications. … Because this volume contains an excellent overview of the current research and issues with low-k dielectric materials for IC applications along with comprehensive practical information, researchers, material scientists, and polymer engineers working in the area of microelectronics will find this book a very valuable addition to their library." (IEEE Electrical Insulation Magazine, Vol. 20 (2), March/April, 2004) "This book addresses issues on the development, characterization and integration of low dielectric constant (k) materials for advanced on-chip interconnects. … this book illustrates in a comprehensive way the technological challenges brought by the introduction of low-k materials into semiconductor manufacturing. … Being intended to researchers and engineers active in the field of semiconductor processing, it can be used as an introductory book … . Highly appreciated." (Jean - Francois de Marneffe, Physicalia, Vol. 25 (4), 2003)

From the Back Cover

Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.

Product Details

  • File Size: 6490 KB
  • Print Length: 310 pages
  • Publisher: Springer; 2003 edition (December 16, 2002)
  • Sold by: Amazon Digital Services, Inc.
  • Language: English
  • ASIN: B000UIQL3W
  • Text-to-Speech: Enabled
  • X-Ray:
  • Word Wise: Not Enabled
  • Lending: Not Enabled
  •  Would you like to give feedback on images?.


Customer Reviews

There are no customer reviews yet.
5 star
4 star
3 star
2 star
1 star
Share your thoughts with other customers

Forums

There are no discussions about this product yet.
Be the first to discuss this product with the community.
Start a new discussion
Topic:
First post:
Prompts for sign-in
 


Look for Similar Items by Category