This volume is dedicated to the field of dry (plasma) etching, as applied in silicon semiconductor processing.
Dry Etching for VLSI
and over one million other books are available for Amazon Kindle.
Learn more
FREE Two-Day Shipping for students on millions of items. Learn more |
| |||||||||||||||
Book Description
Product Details
Would you like to update product info or give feedback on images?
|
More About the Author
Discover books, learn about writers, read author blogs, and more.
Customer Reviews
|
There are no customer reviews yet.
|
|||
|
Video reviews
|
Inside This Book
(learn more)
First Sentence:
In the early days of silicon Integrated Circuit technology circuit dimensions were large (10 µm and up) and wafers were small (2 inch and down). Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
oxygen plasma stripping, single probe method, dry etching systems, linear cascade theory, etch reactor, lateral interference, oxide etch rate, chlorine plasmas, ion bombardment energy, etch anisotropy, optogalvanic spectroscopy, plasma impedance, simultaneous bombardment, chlorine discharge, etching reactors, etch systems, dry etch processes, cathode fall, plasma processing, triple probe, endpoint detection, ion sheath, trench etching, refractory metal silicides, atomic fluorine Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, American Institute of Physics, Solid State Technol, Academic Press, Plasma Chem, Monte Carlo, Vacuum Figure, American Physical Society, Pergamon Press, Plasma Sci, Abstracts of the Electrochem, Internuclear Distance, Methods Phys, Publishing Ltd New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
In the early days of silicon Integrated Circuit technology circuit dimensions were large (10 µm and up) and wafers were small (2 inch and down). Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
oxygen plasma stripping, single probe method, dry etching systems, linear cascade theory, etch reactor, lateral interference, oxide etch rate, chlorine plasmas, ion bombardment energy, etch anisotropy, optogalvanic spectroscopy, plasma impedance, simultaneous bombardment, chlorine discharge, etching reactors, etch systems, dry etch processes, cathode fall, plasma processing, triple probe, endpoint detection, ion sheath, trench etching, refractory metal silicides, atomic fluorine Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, American Institute of Physics, Solid State Technol, Academic Press, Plasma Chem, Monte Carlo, Vacuum Figure, American Physical Society, Pergamon Press, Plasma Sci, Abstracts of the Electrochem, Internuclear Distance, Methods Phys, Publishing Ltd New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
This book cites 3
books:
- Introduction to Physical Chemistry by George Ingham Brown on page 161
- Physical Chemistry by Gordon M. Barrow on page 161
- Atomic and Molecular Radiation Physics (Wiley Monographs on Chemical Physics) by L.G. Christophorou on page 160
Books on Related Topics
(learn more)
|
Tag this product(What's this?)Think of a tag as a keyword or label you consider is strongly related to this product.
Tags will help all customers organize and find favorite items. |
Customer Discussions
|
This product's forum
Active discussions in related forums
Search Customer Discussions
|
Related forums
|
