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Inside This Book
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First Sentence:
The packaging of integrated circuits requires a knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
dhgh product, intrinsic permittivity, slotted electrodes, composite piezoelectric materials, solderable conductors, hydrophone applications, multilayer capacitors, thickness mode resonance, electrooptic ceramics, resistor compositions, multilayer ceramic capacitors, high optical transparency, print thickness, segmented displays, base metal electrodes, maximum rated temperature, squeegee speed, optical bias, titanate dielectrics, zinc oxide varistors, dielectric compositions, piezoelectric composites, fired films, intrinsic degradation, transverse wavelength Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Pennsylvania State University, University Park, Academic Press, Sandia National Laboratories, American Ceramics Society, John Wiley, Naval Research Laboratory, Ultrasonics Symposium, April Meeting, Proceedings of Symposium, San Francisco, Solid State Commun, Acoustic Soc, General Electric Company, Soviet Phys, University of Tokyo Press, Division of Spang, Ferroelectrics Lett, Fracture Mechanics of Ceramics, New Jersey, Philips Res New!
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Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
The packaging of integrated circuits requires a knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
dhgh product, intrinsic permittivity, slotted electrodes, composite piezoelectric materials, solderable conductors, hydrophone applications, multilayer capacitors, thickness mode resonance, electrooptic ceramics, resistor compositions, multilayer ceramic capacitors, high optical transparency, print thickness, segmented displays, base metal electrodes, maximum rated temperature, squeegee speed, optical bias, titanate dielectrics, zinc oxide varistors, dielectric compositions, piezoelectric composites, fired films, intrinsic degradation, transverse wavelength Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Pennsylvania State University, University Park, Academic Press, Sandia National Laboratories, American Ceramics Society, John Wiley, Naval Research Laboratory, Ultrasonics Symposium, April Meeting, Proceedings of Symposium, San Francisco, Solid State Commun, Acoustic Soc, General Electric Company, Soviet Phys, University of Tokyo Press, Division of Spang, Ferroelectrics Lett, Fracture Mechanics of Ceramics, New Jersey, Philips Res New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
This book cites 61
books:
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92
books
cite this book:
See all 92 books citing this book
- Piezoelectric Ceramics by Bernard Jaffe on 5 pages
- Ceramic Materials for Electronics, Third Edition (Materials Engineering) by Relva C. Buchanan in Front Matter, and page 484
- Transformer and Inductor Design Handbook, Third Edition (Electrical and Computer Engineering) by Colonel Wm. T. McLyman in Front Matter (1), and Front Matter (2)
- Fracture Mechanics by R. A. Smith on page 56, and page 138
- Systems Modeling and Computer Simulation (Electrical and Computer Engineering) by Naim Kheir in Front Matter
See all 61 books this book cites
- Ceramic Materials for Electronics, Third Edition (Materials Engineering) by Relva C. Buchanan on 8 pages
- Power Vacuum Tubes Handbook, Second Edition (Electronics Handbook Series) by Jerry Whitaker on 4 pages
- Sol-Gel Science and Technology: Topics in Fundamental Research and Applications (4 Volume Set) by Sumio Sakka on page 98, and page 175
- Fundamentals of Interfacial Engineering (Advances in Interfacial Engineering Series) by Robert J. Stokes on page 665, and page 666
- Electroceramics: Materials, Properties, Applications by A. J. Moulson on page 409, and page 468
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