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Electronic Failure Analysis Handbook [Hardcover]

Perry L. Martin (Author)
5.0 out of 5 stars  See all reviews (4 customer reviews)


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Book Description

0070410445 978-0070410442 February 28, 1999 1
The definitive, all-in-one, cost-saving guide to electronic failure analysis--from the field's top experts

Still digging for the latest developments and techniques in electronic failure analysis? The leading-edge methods for slashing product failure rates are all right here in this complete, comprehensive source. You'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance.

Absolutely essential to anyone concerned with electronic product development and testing, the Handbook gives you ready-to-use, insider information on state-of-the-art EFA techniques; the how's and why's of electronic failures; failure prediction; warranty cost control; liability-costs and other issues.



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From the Back Cover

The definitive, all-in-one, cost-saving guide to electronic failure analysis--from the field's top experts. Still digging for the latest developments and techniques in electronic failure analysis? The leading-edge methods for slashing product failure rates are all right here--in one complete, comprehensive source. In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance. Absolutely essential to anyone concerned with electronic product development and testing, the Electronic Failure Analysis Handbook gives you ready-to-use, insider information on: state-of-the-art EFA techniques; the how's and why's of electronic failures; failure prediction; warranty cost control; liability-costs and other issues.

About the Author

Perry Martin is group manager for reliability and process engineering in the Sacramento, California, division of National Technical Systems. His experience includes more than a decade of performing electronic failure analysis and environmental quality testing for the United States Air Force at McClellan Air Force Base in California. There he provided support and expertise in a number of areas, including the testing and repair of equipment such as avionics, crash and failure investigations for AF weapon systems, and contractor fraud inquiries. He has briefed both members of Congress and the Air Force Chief of Staff on his findings on faults in Air Force weapons systems.

Product Details

  • Hardcover: 520 pages
  • Publisher: McGraw-Hill Professional; 1 edition (February 28, 1999)
  • Language: English
  • ISBN-10: 0070410445
  • ISBN-13: 978-0070410442
  • Product Dimensions: 9.5 x 7.7 x 2.2 inches
  • Shipping Weight: 3 pounds
  • Average Customer Review: 5.0 out of 5 stars  See all reviews (4 customer reviews)
  • Amazon Best Sellers Rank: #2,479,058 in Books (See Top 100 in Books)

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Average Customer Review
5.0 out of 5 stars (4 customer reviews)
 
 
 
 
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6 of 7 people found the following review helpful:
5.0 out of 5 stars The "Bible" in Failure Analysis, November 15, 2001
This review is from: Electronic Failure Analysis Handbook (Hardcover)
After I read this book, I passed it to my Engineers, and afterwhich I never have a chance to access it anymore, as both my Engineers just won't let go!

This is indeed "THE BIBLE" for Failure Analysis. It covers most of the techniques needed for each type of FA, like X-ray imaging, SAM, Thermal imaging, Metallography, Chemical Characterization, SEM/EDX, and Electronic Failures. The best of it all is that in Part 2, it is organized in terms of equipment techniques; in part 3, it is organized in terms of products, like PCB, PCBA, connection, component, etc. As such it give you the flexibility either go to Part 2 and learn about how and what types of failure analysis a particular equipment can perform, or go to Part 3 and find out the sequence of which equipments is to used first for a particular failure mode.

However, I need to highlight that the though there are tons of photos in the book, the quality of the photos need lots of improvement. Many a times, it takes me long time to figure out what's in the photos. Maybe some highlights or markings at the particular spot of interest in the comparison of the photos would help some novice readers to appreciate better

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7 of 9 people found the following review helpful:
5.0 out of 5 stars GOOD STUFF!, March 23, 2000
By A Customer
This review is from: Electronic Failure Analysis Handbook (Hardcover)
The best thing I can say about this book is that I use it every day. Well organized and easy to use. Well done
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1 of 1 people found the following review helpful:
5.0 out of 5 stars Enlightening, June 5, 2009
This review is from: Electronic Failure Analysis Handbook (Hardcover)
We are really dealing with a first class book on the subject. In it you can find a lot of greatly useful informations about F.A. from the testing techniques to the study cases.
To me, what I found impressive is the detailed description of the analysis testing techniques covering the technology description of them and the correct case in which recall them.
For sure a book that you will find helpful. Well spent money!
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Inside This Book (learn more)
First Sentence:
Failure analysis is the process of determining the cause of failure, collecting and analyzing data, and developing conclusions to eliminate the failure mechanism causing specific device or system failures. Read the first page
Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
curve tracer testing, analysis electrical characterization, electronic failure analysis, barrier terminal block, breaker cycled, contact power dissipation, curve tracer results, electrically conductive contaminants, curve tracer display, aircraft circuit breaker, microscope tube body, acoustic micro imaging, emitter bond wire, emissive image, differential infrared thermography, emissivity matrix, failure analysis applications, napless cloth, failed resistors, soldered interconnections, recursive average, initiation voltage, suspect capacitor, bulk scan, conductive circuitry
Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Materials Park, Background Device, John Wiley, Analysis Techniques Employed External Inspection, San Jose, Elapsed Time, Reliability Analysis Center, Surface Mount International Conference, United States, Perkin-Elmer Corp, Drift Moisture, Electronic Materials Handbook, Kennedy Space Center, Metals Handbook, Research Institute, Cambridge Instruments, Infrared Systems, Martin National Technical Systems, Metals Park, Special Publication, Structural Failure, Van Nostrand Reinhold, Justice Traynor, Rome Air Development Center
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