Today, the successful design and manufacture of electronic devices requires expertise in both materials science and manufacturing processes. This reference provides electronics engineers and materials scientists with the information they need on the materials and processes currently used to fabricate, interconnect and package electronic components and systems. Featuring more than 70 percent new or revised material, the second edition of this reference contains information on plastics, elastomers, and laminates; printed wiring boards; ceramics and glasses semiconductors; ferrous and nonferrous metals; wire and cable; metal joining of electronic circuits; thick and thin films; electrodeposition materials and processes; lithography and photofabrication; and materials and processes for advanced packaging.
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Inside This Book
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First Sentence:
There is no doubt that plastics have become one of the dominant materials of the twentieth century. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
electroless nickel boron, metallizing materials, thermostat metals, secondary current distribution, solder mask application, tantalum nitride resistors, copper package, lamination cycle, dielectric pastes, flexible printed wiring, desired circuit pattern, melt stabilization, polysilicon rod, nichrome resistors, beryllia substrates, allyl resins, interconnect substrates, soldering systems, electrodeposited coatings, heater bar, fired thickness, precious metal plating, inflection temperature, resistor pastes, brush plating Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Electrochemical Publications, Cast Alnico, Scientific Guide, Klein Wassink, Martin Marietta Corporation, Sintered Alnico, Academic Press, Illustrated Lecture, Circuits Assembly, Engineered Materials Handbook, Brush Wellman, Marcel Dekker, United States, Courtesy Electro-Science Laboratories, Park Ridge, Solid State Technology, All Good, Circuits Manufacturing, Division of General Ceramics, Good Poor Good Fair Medium, Pont de Nemours, Silver Cross-linked, Excellent Nonflammable, Semiconductor Silicon New!
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Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
There is no doubt that plastics have become one of the dominant materials of the twentieth century. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
electroless nickel boron, metallizing materials, thermostat metals, secondary current distribution, solder mask application, tantalum nitride resistors, copper package, lamination cycle, dielectric pastes, flexible printed wiring, desired circuit pattern, melt stabilization, polysilicon rod, nichrome resistors, beryllia substrates, allyl resins, interconnect substrates, soldering systems, electrodeposited coatings, heater bar, fired thickness, precious metal plating, inflection temperature, resistor pastes, brush plating Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Electrochemical Publications, Cast Alnico, Scientific Guide, Klein Wassink, Martin Marietta Corporation, Sintered Alnico, Academic Press, Illustrated Lecture, Circuits Assembly, Engineered Materials Handbook, Brush Wellman, Marcel Dekker, United States, Courtesy Electro-Science Laboratories, Park Ridge, Solid State Technology, All Good, Circuits Manufacturing, Division of General Ceramics, Good Poor Good Fair Medium, Pont de Nemours, Silver Cross-linked, Excellent Nonflammable, Semiconductor Silicon New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
This book cites 56
books:
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27
books
cite this book:
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- Soldering in Electronics by R.J.Klein Wassink on 11 pages
- Electronic Packaging and Interconnection Handbook 4/E by Charles Harper on 4 pages
- Coombs' Printed Circuits Handbook by Clyde F. Coombs on 4 pages
- Identification of Defects in Semiconductors, Volume 51B (Semiconductors & Semimetals) (Vol 51B) by Michael Stavola on page 297, page 298, and page 299
- Introduction to Solids (Materials science and engineering series) by Leonid V. Azaroff on page 216, and page 296
See all 56 books this book cites
- Handbook of Thick- and Thin-Film Hybrid Microelectronics by Tapan K. Gupta on 14 pages
- Electronic Packaging and Interconnection Handbook 4/E by Charles Harper in Front Matter, and page 872
- Electronic Materials and Processes Handbook (Handbook) by Charles Harper in Front Matter, and page 187
- Hybrid Microelectronics Handbook by Jerry E. Sergent in Front Matter, and page 735
- Thin Film Technology Handbook by Aicha Eishabini-Riad in Front Matter
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