With the help of this expert guide, you can design and package the high-frequency circuitry crucial to the performance of todayÕs advanced electronic products, such as Pentium chips, HDTV, and mobile communications. This book fully explains approaches that include basic signal transmission theory, digital and microwave circuit design, and how these are integrated with the packaging and interconnection characteristics. YouÕll find detailed coverage of signal behavior in both high speed digital and microwave circuits, as well as crucial aspects of materials selection and manufacturing.
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Book Description
Editorial Reviews
From the Back Cover
A comprehensive guide to the packaging of high speed circuits for today's advanced electronic products. This is a unique and expert guide to the design and packaging of the high-frequency circuitry crucial to the performance of today's advanced electronic products, such as Pentium chips, HDTV, and mobile communications. Written by two of the leading innovators in the field, this book fully explains integrated design approaches that will enable you to take advantage of all the latest advances in electronic devices, circuit design, materials, and circuit packaging. You'll read about approaches that include basic signal transmission theory, digital circuit design, and how these are integrated with the packaging and interconnection characteristics. There is detailed coverage of signal behavior in both high speed digital circuits, as well as crucial aspects of materials selection and manufacturing. This state-of-the-art resource also provides you with practical design guidelines--plus information on the major issues of design verification and perfomance evaluation.
About the Author
Stephen G. Konsowski has 34 years of electronic packaging engineering experience. Retired from Westinghouse as an an advisory engineer, he is now associated with Technology Seminars, Inc. of Lutherville, Maryland. He is a founding member of the Intenrational Electronics Packaging Society (IEPS) and one of its former directors. Mr. Konsowski has authored many technical papers and articles on electronic packaging, including a chapter for the Second Edition of McGraw-HillÕs Handbook of Electronic Materials and Processes and Handbook of Packaging and Interconnection. Arden R. Helland is an advisory engineer at the Northrop Grumman CorporationÕs Electronic Sensors and Systems Division with over 35 years of experience in all phases of electrical design for advanced electronic systems. He is the author of the chapter on the reliability digital systems for the McGraw-Hill Computer Engineering Handbook.
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Most Helpful Customer Reviews
3.0 out of 5 stars
Not very mathematical... not very useful...,
By JASA "JASA" (Portugal) - See all my reviews
Amazon Verified Purchase(What's this?)
This review is from: Electronic Packaging of High Speed Circuitry (Hardcover)
This book is broad on its coverage, but it treats the matters mostly at the qualitative level. So it is perhaps good for technicians and newcomers to the high speed/high frequency field but it misses the quantitative analysis and discussion needed to perform design of products and engineering. For instance, high frequency models of devices (e.g. at Spice level) accounting for packaging effects (e.g. wire bonding, etc...) are not discussed or even presented. As such I think that this was a wrong acquisition for me.
0 of 1 people found the following review helpful:
5.0 out of 5 stars
Great for understanding the field !,
By "rouchard" (Attleboro, Ma. USA) - See all my reviews
This review is from: Electronic Packaging of High Speed Circuitry (Hardcover)
Only made it to 2nd chapter so far, but very informative in the understanding of the field for someone just beginning the world of high speed packaging with concise explanations.
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Inside This Book
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First Sentence:
The subject of packaging electronic circuits is very broad, covering such items as features and specifications of the components that comprise the circuits, the materials from which the interconnect media are made, design rules for efficient packaging, thermal considerations, processes to encapsulate or otherwise protect the circuit, testing, and special design characteristics germane to the nature of the circuit. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
party line bus, midpoint waveform, second undershoot, input clamp diodes, signal return reference, initial signal level, source termination resistance, new signal transition, first incident wave, final signal level, common mode crosstalk, percent rise time, linear rise time, signal excursion, reflection diagram, total rise time, falling edge transition, diode termination, incident wave switching, rising edge transition, waveshape distortion, inactive drivers, initial undershoot, forward conduction region, split termination Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Santa Clara, National Semiconductor Corporation, Computer Engineering Handbook, Bit Times Figure, Logic Databook, System Design Handbook, Vcc P-Channel, Artech House, David Wyland, Electromagnetic Compatibility, Hewlett-Packard Company, High Figure, Low Parameter, Microwaves Made Simple, Quality Semiconductor Databook, Resistor Output Logic Gives High Speed, Richard Brown, Synergy Product Data Book, Technical Monogram New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
The subject of packaging electronic circuits is very broad, covering such items as features and specifications of the components that comprise the circuits, the materials from which the interconnect media are made, design rules for efficient packaging, thermal considerations, processes to encapsulate or otherwise protect the circuit, testing, and special design characteristics germane to the nature of the circuit. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
party line bus, midpoint waveform, second undershoot, input clamp diodes, signal return reference, initial signal level, source termination resistance, new signal transition, first incident wave, final signal level, common mode crosstalk, percent rise time, linear rise time, signal excursion, reflection diagram, total rise time, falling edge transition, diode termination, incident wave switching, rising edge transition, waveshape distortion, inactive drivers, initial undershoot, forward conduction region, split termination Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Santa Clara, National Semiconductor Corporation, Computer Engineering Handbook, Bit Times Figure, Logic Databook, System Design Handbook, Vcc P-Channel, Artech House, David Wyland, Electromagnetic Compatibility, Hewlett-Packard Company, High Figure, Low Parameter, Microwaves Made Simple, Quality Semiconductor Databook, Resistor Output Logic Gives High Speed, Richard Brown, Synergy Product Data Book, Technical Monogram New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
This book cites 29
books:
See all 29 books this book cites
4
books
cite this book:
- Computer Engineering Handbook by C. H. Chen on 9 pages
- Electronic Packaging, Microelectronics, and Interconnection Dictionary by Charles A. Harper in Front Matter, and Back Matter
- Electronic Packaging and Interconnection Handbook 4/E by Charles Harper in Front Matter, and Back Matter
- Juran's Quality Control Handbook by J.M. Juran in Front Matter
- Network Analysis by Mac E. Van Valkenburg on page 209
See all 29 books this book cites
- Mems Packaging (EMIS Processing) by Tai-Ran Hsu on page 203
- Electronic Packaging and Interconnection Handbook 4/E by Charles Harper on page 954
- Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies by John H. Lau in Front Matter
- High Performance Printed Circuit Boards by Charles A. Harper on page 136
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