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Electronic Packaging Materials and Their Properties
 
 
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Electronic Packaging Materials and Their Properties [Hardcover]

Michael Pecht (Author), Rakish Agarwal (Author), F. Patrick McCluskey (Author), Terrance J. Dishongh (Author), Sirus Javadpour (Author), Rahul Mahajan (Author)
3.0 out of 5 stars  See all reviews (2 customer reviews)

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Book Description

0849396255 978-0849396250 December 18, 1998 1
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:
  • interconnections
  • printed circuit boards
  • substrates
  • encapsulants
  • dielectrics
  • die attach materials
  • electrical contacts
  • thermal materials
  • solders
    Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

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    Product Details

    • Hardcover: 128 pages
    • Publisher: CRC Press; 1 edition (December 18, 1998)
    • Language: English
    • ISBN-10: 0849396255
    • ISBN-13: 978-0849396250
    • Product Dimensions: 9.3 x 6.2 x 0.6 inches
    • Shipping Weight: 12.6 ounces (View shipping rates and policies)
    • Average Customer Review: 3.0 out of 5 stars  See all reviews (2 customer reviews)
    • Amazon Best Sellers Rank: #2,684,870 in Books (See Top 100 in Books)

     

    Customer Reviews

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    1 of 1 people found the following review helpful:
    5.0 out of 5 stars Well organized reference book, January 3, 2000
    By 
    Rama Maiti (United States) - See all my reviews
    This review is from: Electronic Packaging Materials and Their Properties (Hardcover)
    The material in the book is organized in a manner that makes it easy for a packaging engineer to find and use the information. It speaks the language of a practicing engineer. The reader can compare the competing materials for each application and make a decision about material choice.

    The property tables are all in international units which makes it easy to compare the information from otherr sources. The book provides a detailed list of references on each topic.

    It is an excellent choice as a graduate or upper level undergraduate text book for students who are beginning their studies on electronic packaging.

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    3 of 4 people found the following review helpful:
    1.0 out of 5 stars This book is not very detailed or complete., September 22, 1999
    By A Customer
    This review is from: Electronic Packaging Materials and Their Properties (Hardcover)
    This text is incomplete. It can best be characterized as an overview. The length is very short and the shallow nature of the content makes it not very useful for design work. It has truncated materials properties tables and one paragraph descriptions of the various issues packge designers are faced with.
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    Inside This Book (learn more)
    First Sentence:
    Signal processing is critical for the operation of an electronic system, and materials, along with their architectures, play an important role in the propagation of signals, especially for circuits operating at high speeds and at high electrical frequency. Read the first page
    Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
    volumetric resistivity, constraining cores, resin volume fraction, electronic packaging materials, electrodeposited copper, cyanate ester resins, thermocompression bonding, arc resistance, deflection temperature, loss tangent, surface resistivity, oxygen index, rolled copper, impact toughness, good electrical properties, volume resistivity, laminate materials, fatigue endurance, fiber volume fraction
    Key Phrases - Capitalized Phrases (CAPs): (learn more)
    Material Thermal
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