Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.
Electronic Packaging for High Reliability, Low Cost Elect...
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Inside This Book
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Key Phrases - Statistically Improbable Phrases (SIPs):
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underfill formulations, noise indices, underfill materials, underfill encapsulant, large area processing, peripheral pads, virtual costs, curing profile, chip size packages, metal acetylacetonate, noise index, flip chip mounting, silver flakes, paddle size, package geometry, flip chip technology, sheet resistivities, molding compound, low cost electronics, conductive adhesives, flip chip bonding, noise spectral density, thick film resistors, thin packages, silver paste Key Phrases - Capitalized Phrases (CAPs): (learn more)
Kluwer Academic Publishers, International Conference, New York, Czech Republic, Dielectric Alumina, High Technology, Proceed Int, San Jose, Weight Loss, Academic Press, Sensor Technologies New!
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underfill formulations, noise indices, underfill materials, underfill encapsulant, large area processing, peripheral pads, virtual costs, curing profile, chip size packages, metal acetylacetonate, noise index, flip chip mounting, silver flakes, paddle size, package geometry, flip chip technology, sheet resistivities, molding compound, low cost electronics, conductive adhesives, flip chip bonding, noise spectral density, thick film resistors, thin packages, silver paste Key Phrases - Capitalized Phrases (CAPs): (learn more)
Kluwer Academic Publishers, International Conference, New York, Czech Republic, Dielectric Alumina, High Technology, Proceed Int, San Jose, Weight Loss, Academic Press, Sensor Technologies New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
This book cites 5
books:
1
book
cites this book:
- Structural Analysis in Microelectronics and Fiber Optics (EEP) by Ephram Suhir on page 44, and page 51
- A30.5 Integrated Circuits Video by Thomson Delmar Learning on page 24
- Structural Analysis in Microelectronics and Fiber Optics Vol. 1 : Basic Principles of Engineering Elasticity and Structural Analysis (Electrical Engineering) by Ephraim Suhir on page 51
- The Czech Republic by David Short on page 78
- Multichip Modules with Integrated Sensors (NATO Science Partnership Sub-Series: 3:) by W.K. Jones on page 78
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