Electronics Manufacturing : with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials [Hardcover]

John Lau (Author), C.P. Wong (Author), Ning-Cheng Lee (Author), Ricky Lee (Author)

Book Description

Series: Pro Engineering | Publication Date: August 23, 2002

This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growing field. Written for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical and marketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies. Among the topics explored: chip (wafer) level interconnects with lead-free solder bumps; lead-free solder wafer bumping with micro-ball mounting and paste printing methods; lead-free solder joint reliability of WLCSPs on organic and ceramic substrates; chip (wafer) level interconnects with solderless bumps such as Ni-Au, Au, and Cu, Cu wires, Au wires, Au studs, and Cu studs; design, materials, process, and reliability of WLCSPs with solderless interconnects on PCB/substrate; halogen-free molding compounds for PQFP, PBGA, and MAP-PBGA packages; environmentally benign die-attach films for PQFP and PBGA packages and lead-free die-attach bonding techniques for IC packaging; environmental issues for conventional PCBs and substrates; some environmentally conscious flame-retardants for PCBs and organic substrates; emerging technologies for fabricating environmental friendly PCBs such as design for environment, green PCB manufacturing, and environmental safety. It also includes the topics: lead-free soldering activities such as legislation, consortia programs, and regional preferences on lead-free solder alternatives; criteria, development approaches, and varieties of alloys and properties of lead-free solders; physical, mechanical, chemical, electrical, and soldering properties of lead-free solders; manufacturing process and performance of lead-free surface finishes for both PCB and component applications; implementation and execution challenges of lead-free soldering, especially for the reflow and wave soldering process; fundamental understanding of electrically conductive adhesive (ECA) technology; effects of lubricant removal and cure shrinkage on ECAs; mechanisms underlying the contact resistance shifts of ECAs; effects of electrolytes and moisture absorption on contact resistance shifts of ECAs; and stabilization of contact resistance of ECAs using various additives.

Editorial Reviews

Review

"An excellent book in Flip Chip Technologies, March 2, 2000 Reviewer: David Young from Boston, MA I bought this book at NEPCON West on February 29 and read it on my way home to Boston. I like it very much! This book covers all the important subjects (many of those I am not aware of) on low-cost flip chip Technologies. Also, for each subject, useful data, technical know-how, and engineering analyses are presented. I strongly recommend it to everyone who is working in electronic packaging and interconnections. I am sure you will find it useful! Online reader review of Lau's Low Cost Flip Chip Technologies

From the Back Cover

ELECTRONICS MANUFACTUIRNG WITH LEAD-FREE, HALOGEN-FREE, AND CONDUCTIVE-ADHESTIVE MATERIALS

This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growing field.

Written for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical and marketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies. Among the topics explored:

* Chip (wafer) level interconnects with lead-free solder bumps
* Lead-free solder wafer bumping with micro-ball mounting and paste printing methods
* Lead-free solder joint reliability of WLCSPs on organic and ceramic substrates
* Chip (wafer) level interconnects with solderless bumps such as Ni-Au, Au, and Cu, Cu wires, Au wires, Au studs, and Cu studs
* Design, materials, process, and reliability of WLCSPs with solderless interconnects on PCB/substrate
* Halogen-free molding compounds for PQFP, PBGA, and MAP-PBGA packages
* Environmentally benign die-attach films for PQFP and PBGA packages and lead-free die-attach bonding techniques for IC packaging
* Environmental issues for conventional PCBs and substrates
* Some environmentally conscious flame-retardants for PCBs and organic substrates
* Emerging technologies for fabricating environmental friendly PCBs such as design for environment, green PCB manufacturing, and environmental safety
* Lead-free soldering activities such as legislation, consortia programs, and regional preferences on lead-free solder alternatives
* Criteria, development approaches, and varieties of alloys and properties of lead-free solders
* Physical, mechanical, chemical, electrical, and soldering properties of lead-free solders
* Manufacturing process and performance of lead-free surface finishes for both PCB and component applications
* Implementation and execution challenges of lead-free soldering, especially for the reflow and wave soldering process
* Fundamental understanding of electrically conductive adhesive (ECA) technology
* Effects of lubricant removal and cure shrinkage on ECAs
* Mechanisms underlying the contact resistance shifts of ECAs
* Effects of electrolytes and moisture absorption on contact resistance shifts of ECAs
* Stabilization of contact resistance of ECAs using various additives

See all Editorial Reviews

Product Details

• Hardcover: 700 pages
• Publisher: McGraw-Hill Professional; 1 edition (August 23, 2002)
• Language: English
• ISBN-10: 0071386246
• ISBN-13: 978-0071386241
• Product Dimensions: 9.5 x 6 x 1.6 inches
• Shipping Weight: 2.3 pounds (View shipping rates and policies)
• Average Customer Review: 5.0 out of 5 stars  See all reviews (2 customer reviews)
• Amazon Best Sellers Rank: #2,385,179 in Books (See Top 100 in Books)

Customer Reviews

Most Helpful Customer Reviews

4 of 6 people found the following review helpful:

5.0 out of 5 stars Outstanding book in electronics manufacturing, November 4, 2002

By 

Bill Collier (Singapore) - See all my reviews

This review is from: Electronics Manufacturing : with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials (Hardcover)

This is a very special book!
The focus of this book is on leadfree soldering: from chip-level interconnects, IC packaging, printed circuit board (PCB) fabrication, to PCB assemblies. It provides many useful information and engineering data related to leadfree soldering. These include: design, material selection, process development, equipment selection, manufacturing, and reliability of leadfree soldering. I found these information very useful for my job as an R&D engineer.

This book is very unique!
Even it's focus is on leadfree sodering, however, this book talks about the major problems created by leadfree soldering. These include halogen-free molding compounds for plastic packages and halogen-free epoxy resins for PCBs. This information helps me to design my electronic and photonic products so they can withstand the leadfree soldering environments.

This book is wonderful!
One of the alternatives to leadfree soldering is to use conductive adhesives. This book talks about this very important subject in great details. I enjoy very much in reading the technical contents underlining this technology.

Overall, this is a great book! I would like to recommend to everyone who is working in electronic and optoelectronic products. Hats off to the authors for writing such a comprehensive handbook on leadfree soldering. Congratulations!

3 of 5 people found the following review helpful:

5.0 out of 5 stars Just a nice Handbook on Leadfree Soldering, October 14, 2002

By 

Bill Collier (Singapore) - See all my reviews

This review is from: Electronics Manufacturing : with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials (Hardcover)

I like this book very much! This is the most comprehensive Handbook to leadfree soldering I have ever seen. I learned a lot from this book and it is very useful for my jobs. I carry it with me when I am at work. I open this book when I have problems, and it can always help me find the solutions. I recommend this book to all the manufacturing engineers and managers who are designing and making electronics products.