Unmodified, epoxy resins cause certain problems for both the adhesive formulator and end-user. They are often rigid and brittle; hence, impact resistance and peel strength are poor. For decades, Chemist have been vigorously working to minimize these major shortcomings. Based on a popular course sponsored by the Society of Plastics Engineers and written by an authority in the field, this comprehensive text presents a variety of methods to accomplish what up to now has been a formidable task. Beginning with epoxy chemistry, moving on to fillers, filler treatments, and surfactants, and ending with current and future development in formulating Epoxy Adhesives, this rigorous text addressed the problem of improving flexibility, durability and strength by adding chemical groups to the epoxy structure either via the base resin or the curing agent or by adding separate flexibilizing resins to the formulation to create an epoxy-hybrid adhesive.
Epoxy Adhesive Formulations (Chemical Engineering)
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CRITICAL CHEMICAL METHODS FOR INCREASING EPOXY STRENGTH, FLEXIBILITY, AND DURABILITY
- Epoxy properties and characteristics
- Techniques for improving epoxy strength, flexibility, and durability
- Testing and quality control guidelines
Based on a popular course sponsored by the Society of Plastics Engineers, this comprehensive text presents a variety of methods to ensure optimum epoxy performance and reliability.
The book begins with the fundamentals of epoxy chemistry, then quickly moves on to topics such as: fillers, filler treatments, and surfactants. Inside the book you'll find techniques for improving flexibility, durability and strength of epoxy adhesive formulations.
Complete Details on Formulating Epoxy Adhesives, Including:
- Chemical properties of various epoxies
- Testing and quality control methods
- Regulations and standards
- Optimal formulations and manufacturing processes
SINGLE-SOURCE GUIDANCE ON THE FORMULATION OF EPOXY ADHESIVES:
* Introduction to the Formulation of Epoxy Adhesives * Epoxy Polymer Properties * Quality Control, Tests, and Regulations * Epoxy Resins * Epoxy Curing Agents and Catalysts * Modifying Constituents * Epoxy Polymer Morphology * Property Improvements via Formulation * Formulations Based on Type of Substrate * Formulations Based on Cure or Application Methods * Formulation Based on End Use * Formulation Based on Environment * Processing of Epoxy Formulations
About the Author
Edward Petrie has been active in the adhesives industry for over 35 years -- both in the formulation side and the end-use sides of the industry. He has a BS (Chemical Engineering) and MS (Polymer Science) degrees from Carnegie Mellon University and an MBA from Duquesne University. Throughout his 35 years in the industry.
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This review is from: Epoxy Adhesive Formulations (Chemical Engineering) (Hardcover)
This is a very well written reference book. If you have a little background that would be enough to get you through this material. I bought the book to help me troubleshoot an epoxy issue I have at work and I found all the information that I needed (between this book and another written by the same author "Handbook of Adhesives and Sealants". Both compliment each other very well.
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Inside This Book
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First Sentence:
Epoxy adhesives are chemical compounds used to join components by providing a bond between two surfaces. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
epoxy resin technology, epoxide resins, property mix, waterborne epoxy dispersions, adhesive applications, epoxide adhesives, adhesive bonds, solid epoxy adhesives, epoxy adhesive formulations, epoxy adhesive systems, amidoamine curing agents, room temperature curing epoxy adhesives, certain curing agents, cured epoxy adhesives, adhesive formulator, epoxy adhesive cured, hybrid adhesives, induction curing, bonded aluminum joints, room temperature curing agents, nonreactive diluents, curing agent component, modified epoxy adhesives, polyimide parts, uncontrolled humidity Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Resolution Performance Products, Adhesives Age, Marcel Dekker, Epoxy Resin Adhesives, Nostrand Reinhold, Materials Park, Component Parts, Handbook of Adhesives, Engineered Materials Handbook, Cabot Corp, Technical Bulletin, Plenum Press, Journal of Applied Polymer Science, Journal of Adhesion, Starting Formulation, The Durability of Structural Adhesive Joints, Interscience Publishers, Amspec Chemical, Materials Engineering, Property Tensile, Modern Plastics, United States, Adhesive Modifiers, Property Viscosity Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Epoxy adhesives are chemical compounds used to join components by providing a bond between two surfaces. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
epoxy resin technology, epoxide resins, property mix, waterborne epoxy dispersions, adhesive applications, epoxide adhesives, adhesive bonds, solid epoxy adhesives, epoxy adhesive formulations, epoxy adhesive systems, amidoamine curing agents, room temperature curing epoxy adhesives, certain curing agents, cured epoxy adhesives, adhesive formulator, epoxy adhesive cured, hybrid adhesives, induction curing, bonded aluminum joints, room temperature curing agents, nonreactive diluents, curing agent component, modified epoxy adhesives, polyimide parts, uncontrolled humidity Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Resolution Performance Products, Adhesives Age, Marcel Dekker, Epoxy Resin Adhesives, Nostrand Reinhold, Materials Park, Component Parts, Handbook of Adhesives, Engineered Materials Handbook, Cabot Corp, Technical Bulletin, Plenum Press, Journal of Applied Polymer Science, Journal of Adhesion, Starting Formulation, The Durability of Structural Adhesive Joints, Interscience Publishers, Amspec Chemical, Materials Engineering, Property Tensile, Modern Plastics, United States, Adhesive Modifiers, Property Viscosity Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
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