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Etching in Microsystem Technology [Hardcover]

Michael Köhler (Author)


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Book Description

June 18, 1999 3527295615 978-3527295616 1
Microcomponents and microdevices are increasingly finding application in everyday life. The specific functions of all modern microdevices depend strongly on the selection and combination of the materials used in their construction, i.e., the chemical and physical solid-state properties of these materials, and their treatment. The precise patterning of various materials, which is normally performed by lithographic etching processes, is a prerequisite for the fabrication of microdevices.
The microtechnical etching of functional patterns is a multidisciplinary area, the basis for the etching processes coming from chemistry, physics, and engineering.
The book is divided into two sections: the wet and dry etching processes are presented in the first, general, section, which provides the scientific fundamentals, while a catalog of etching bath composition, etching instructions, and parameters can be found in the second section. This section will enhance the comprehension of the general section and also give an overview of data that are essential in practice.

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Language Notes

Text: English (translation)
Original Language: German

From the Back Cover

Michael Köhler Etching in Microsystem Technolgy Microcomponents and microdevices are increasingly finding application in everyday life. The specific functions of all modern micro-devices depend strongly on the selection and combination of the materials used in their construction, i.e., the chemical and physical solid-state properties of these materials, and their treatment. The precise patterning of various materials, which is normally performed by lithographic etching processes, is a prerequisite for the fabrication of microdevices. The microtechnical etching of functional patterns is a multidisciplinary area, the basis for the etching processes coming from chemistry, physics, and engineering. The book is divided into two sections: the wet and dry etching processes are presented in the first, general, section, which provides the scientific fundamentals, while a catalog of etching bath compositions, etching instructions, and parameters can be found in the second section. This section will enhance the comprehension of the general section and also give an overview of data that are essential in practice.

Product Details

  • Hardcover: 384 pages
  • Publisher: Wiley-VCH; 1 edition (June 18, 1999)
  • Language: English
  • ISBN-10: 3527295615
  • ISBN-13: 978-3527295616
  • Product Dimensions: 9.6 x 6.9 x 0.9 inches
  • Shipping Weight: 1.8 pounds
  • Amazon Best Sellers Rank: #5,380,117 in Books (See Top 100 in Books)

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Inside This Book (learn more)
First Sentence:
Microtechnical patterning methods deal with the preparation and application of components that cannot be prepared by classical mechanical methods. Read the first page
Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
anodic partial process, cathodic partial process, vapour etching, planar plate reactor, etch potential, alkaline hexacyanoferrate, acidic hydrogen peroxide solution, thermalized particles, sidewall depositions, etching gases, etch rate, energized particles, etching media, etch removal, plasma conditions, beam etching processes, etching behaviour, photoelectrochemical etching, etching medium, energized ions, etchant composition, soluble reaction products, diffusion layer thickness, oxygen plasma etching, etch grooves
Key Phrases - Capitalized Phrases (CAPs): (learn more)
Preparation of Free-Standing Micropatterns, Etchig Methods
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