Failure Mechanisms in Semiconductor Devices Second Edition E. Ajith Amerasekera Texas Instruments Inc., Dallas, USA Farid N. Najm University of Illinois at Urbana-Champaign, USA Since the successful first edition of Failure Mechanisms in Semiconductor Devices, semiconductor technology has become increasingly important. The high complexity of today's integrated circuits has engendered a demand for greater component reliability. Reflecting the need for guaranteed performance in consumer applications, this thoroughly updated edition includes more detailed material on reliability modelling and prediction. The book analyses the main failure mechanisms in terms of cause, effects and prevention and explains the mathematics behind reliability analysis. The authors detail methodologies for the identification of failures and describe the approaches for building reliability into semiconductor devices. Their thorough yet accessible text covers the physics of failure mechanisms from the semiconductor die itself to the packaging and interconnections. Incorporating recent advances, this comprehensive survey of semiconductor reliability will be an asset to both engineers and graduate students in the field.
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Failure Mechanisms in Semiconductor Devices Second Edition E. Ajith Amerasekera Texas Instruments Inc., Dallas, USA Farid N. Najm University of Illinois at Urbana-Champaign, USA Since the successful first edition of Failure Mechanisms in Semiconductor Devices, semiconductor technology has become increasingly important. The high complexity of today's integrated circuits has engendered a demand for greater component reliability. Reflecting the need for guaranteed performance in consumer applications, this thoroughly updated edition includes more detailed material on reliability modelling and prediction. The book analyses the main failure mechanisms in terms of cause, effects and prevention and explains the mathematics behind reliability analysis. The authors detail methodologies for the identification of failures and describe the approaches for building reliability into semiconductor devices. Their thorough yet accessible text covers the physics of failure mechanisms from the semiconductor die itself to the packaging and interconnections. Incorporating recent advances, this comprehensive survey of semiconductor reliability will be an asset to both engineers and graduate students in the field.
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Inside This Book
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The estimation of component reliability is of major importance to equipment and systems manufacturers. Read the first page Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, John Wiley, Reliability Fundamentals, Elsevier Science, Sara Burgerhartstraat, The Netherlands, Heterojunction Bipolar, Van Nostrand Reinhold, Microelectronics Packaging Handbook, New Better, Effects Failure, Engineering Design, European Rel, Physics Conf, Research Ltd, Shell-De Guzman New!
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Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
The estimation of component reliability is of major importance to equipment and systems manufacturers. Read the first page Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, John Wiley, Reliability Fundamentals, Elsevier Science, Sara Burgerhartstraat, The Netherlands, Heterojunction Bipolar, Van Nostrand Reinhold, Microelectronics Packaging Handbook, New Better, Effects Failure, Engineering Design, European Rel, Physics Conf, Research Ltd, Shell-De Guzman New!
Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
This book cites 22
books:
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25
books
cite this book:
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- Reliability in Engineering Design by Kailash C. Kapur on page 66, page 251, and page 262
- Semiconductor devices on page 191, page 266, and Back Matter
- Semiconductor Power Devices: Physics of Operation and Fabrication Technology by Sorab K. Ghandhi on page 138, and page 188
- Probability, Random Variables and Stochastic Processes with Errata Sheet by Athanasios Papoulis on page 65, and page 280
- Statistical Theory of Reliability and Life Testing: Probability Models by Richard Barlow on page 66, and page 262
See all 22 books this book cites
- Accelerated Stress Testing Handbook: Guide for Achieving Quality Products by H. Anthony Chan on page 132, and Back Matter
- Essentials of Electronic Testing for Digital, Memory, and Mixed-Signal VLSI Circuits (Frontiers in Electronic Testing Volume 17) by M. Bushnell in Back Matter (1), and Back Matter (2)
- Failure Analysis of Integrated Circuits: Tools and Techniques (The Springer International Series in Engineering and Computer Science) by Lawrence C. Wagner on page 40
- Fault Injection Techniques and Tools for Embedded Systems Reliability Evaluation (Frontiers in Electronic Testing) by Alfredo Benso in Back Matter
- Failure Analysis of Engineering Materials by Charles Brooks on page 455
See all 25 books citing this book
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