With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
Failure Modes And Mechanisms In Electronic Packages
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Inside This Book
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First Sentence:
Developments in the semiconductor industry, along with consumer demand for cheaper, lighter, high-density information processing tools, have in effect revolutionized the entire electronic packaging infrastructure. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
printed circuit carrier, solder ball formation, solder joint voids, copper discontinuity, solder mask surface, plating voids, wave solder process, epoxy smear, fretting mechanism, elastomeric connectors, fine pitch surface mount technology, solder balling, surface insulation resistance, solder particles, connector reliability, gold intermetallics, solder joint reliability, insertion mount, connector failures, copper migration, reflow process, contact reliability, silver migration, whisker growth, solder joint failures Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Reliability Physics, Circuit World, Van Nostrand Reinhold, Annual Proceedings, John Wiley, Texas Instruments Inc, American Society of Metals, Metals Park, San Francisco, Suggested Readings, Advanced Packaging, Buehler Ltd, Circuits Assembly, Connection Technology, Las Vegas, Metal Digest, Packages Figure, Printed Circuit Fabrication, Applied Life Data Analysis, Circuits Manufacturing, Instrumental Methods of Analysis, Journal of the Electrochemical Society, Prototype Built, Sanders Road New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Developments in the semiconductor industry, along with consumer demand for cheaper, lighter, high-density information processing tools, have in effect revolutionized the entire electronic packaging infrastructure. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
printed circuit carrier, solder ball formation, solder joint voids, copper discontinuity, solder mask surface, plating voids, wave solder process, epoxy smear, fretting mechanism, elastomeric connectors, fine pitch surface mount technology, solder balling, surface insulation resistance, solder particles, connector reliability, gold intermetallics, solder joint reliability, insertion mount, connector failures, copper migration, reflow process, contact reliability, silver migration, whisker growth, solder joint failures Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Reliability Physics, Circuit World, Van Nostrand Reinhold, Annual Proceedings, John Wiley, Texas Instruments Inc, American Society of Metals, Metals Park, San Francisco, Suggested Readings, Advanced Packaging, Buehler Ltd, Circuits Assembly, Connection Technology, Las Vegas, Metal Digest, Packages Figure, Printed Circuit Fabrication, Applied Life Data Analysis, Circuits Manufacturing, Instrumental Methods of Analysis, Journal of the Electrochemical Society, Prototype Built, Sanders Road New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
This book cites 33
books:
See all 33 books this book cites
2
books
cite this book:
- Applied Life Data Analysis (Wiley Series in Probability and Statistics) by Wayne B. Nelson on page 94, page 307, and Back Matter
- Handbook Of Fine Pitch Surface Mount Technology (Electrical Engineering) by John H. Lau on page 94, page 278, and Back Matter
- Instrumental Methods of Analysis (Chemistry) by Hobart H. Willard on page 118, page 122, and page 133
- Principles of Electronic Packaging by Donald Seraphim on page 308, Back Matter (1), and Back Matter (2)
- Accelerated Testing by Nelson on page 94, and page 307
See all 33 books this book cites
- Failure Analysis of Engineering Materials by Charles Brooks on page 456
- Parts Selection and Management by Michael Pecht on page 202
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