As the circuit densities of modern electronic systems continue to increase dramatically, so too has the popularity of flexible printed circuit boards. With their substrates of polyamides like Kapton or Mylar that enable bending and twisting, this new breed of circuitry affords designers the ability to work with much more surface area within much smaller spaces. Here is the most complete and cohesive guide to this burgeoning field yet published. A one-stop resource for engineers who need practical information on how to successfully design and assemble flexible circuitry, it includes detailed discussion of the relationship between design variations and overall cost.
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1 of 1 people found the following review helpful:
5.0 out of 5 stars
A worthy addition to any electronics engineering library,
By A Customer
This review is from: Flexible Printed Circuitry (Hardcover)
Industry veteran Thomas Stearns has provided the electronics industry with the latest book on the increasingly popular subject of flexible circuits. In a brief but comprehensive thirteen chapters, Mr. Stearns provides valuable lessons "from the trenches" garnered from his long and distinguished career in the flexible circuits industry. Full of practical experience from his long involvement with flex circuit technology, the author provides valuable insight into the inner workings of flex circuits from design through manufacturer, punctuating the text with practical examples and "rules of thumb", while providing a strong sense of the history and evolution of this novel electrical/electronics interconnection technology.
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Inside This Book
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First Sentence:
This is a book about flexible printed wiring. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
adhesiveless materials, coverlayer lamination, coverlayer film, reverse baring, semiadditive process, plated throughhole, bookbinder design, flexural endurance, flexible printed wiring, adhesiveless laminates, cluster registration, tooling pins, base dielectric, wire harnessing, tooling holes, cap boards, laminate voids, deposited metallization, etch factor, shield planes, lamination temperature, rigid areas, conductor density, conductor pattern, adhesive flow Key Phrases - Capitalized Phrases (CAPs): (learn more)
Courtesy Teledyne Electronic Technologies, Courtesy Parlex Corp, Sanders Associates, United States New!
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Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
This is a book about flexible printed wiring. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
adhesiveless materials, coverlayer lamination, coverlayer film, reverse baring, semiadditive process, plated throughhole, bookbinder design, flexural endurance, flexible printed wiring, adhesiveless laminates, cluster registration, tooling pins, base dielectric, wire harnessing, tooling holes, cap boards, laminate voids, deposited metallization, etch factor, shield planes, lamination temperature, rigid areas, conductor density, conductor pattern, adhesive flow Key Phrases - Capitalized Phrases (CAPs): (learn more)
Courtesy Teledyne Electronic Technologies, Courtesy Parlex Corp, Sanders Associates, United States New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
This book cites 14
books:
See all 14 books this book cites
4
books
cite this book:
- Solders and Soldering: Materials, Design, Production, and Analysis for Reliable Bonding by Howard H. Manko in Front Matter
- Electronic Packaging and Interconnection Handbook 4/E by Charles Harper in Front Matter
- Microchip Fabrication, 5th Ed. by Peter Van Zant in Front Matter
- Juran's Quality Control Handbook by J.M. Juran in Front Matter
- Electronic Packaging, Microelectronics, and Interconnection Dictionary by Charles A. Harper in Front Matter
See all 14 books this book cites
- Materials for Rigid and Flexible Printed Wiring Boards (Electrical and Computer Engineering) by Martin W. Jawitz on page 66
- Flip Chip Technologies by John H. Lau in Front Matter
- Optimizing Quality in Electronics Assembly: A Heretical Approach by James Smith in Front Matter
- Passive Electronic Component Handbook by Charles A. Harper on page 649
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