The electronics industry is abuzz with talk of flip chip technologies (FCT), the group of revolutionary new techniques that enable chips to be connected to substrates without the use of wires. By literally placing the chip upside down and in direct contact with the substrate, FCT is a highly efficient-and increasingly popular-alternative to traditional bonding techniques. This is the first book to cover all of the major design, materials, and manufacturing issues related to FCT. Featuring authoritative contributions from the world's leading experts, this volume provides in depth discussion of all five contact points.
FREE Two-Day Shipping for Students. Learn more |
Book Description
Editorial Reviews
About the Author
John H. Lau received his Ph.D. degree in Theoretical and Applied Mechanics from the University of Illinois (1977), a M.A.Sc. degree in Structural Engineering from the University of British Columbia (1973), a second M.S. degree in Engineering Physics from the University of Wisconsin (1974), and a third M.S. degree in Management Science from Fairleigh Dickinson University (1981). He also has a B.E. degree in Civil Engineering from National Taiwan University (1970). John is an interconnection technology scientist at Agilent Technologies, Inc. His current interests cover a broad range of electronic and optoelectronic packaging and manufacturing technology. Prior to Agilent, he worked for Express Packaging Systems, Hewlett-Packard Company, Sandia National Laboratory, Bechtel Power Corporation, and Exxon Production and Research Company. With more than 30 years of R&D and manufacturing experience in the electronics, petroleum, nuclear, and defense industries, he has given over 200 workshops, authored and co-authored over 180 peer reviewed technical publications, and is the author and editor of 13 books: Solder Joint Reliability; Handbook of Tape Automated Bonding; Thermal Stress and Strain in Microelectronics Packaging; The Mechanics of Solder Alloy Interconnects; Handbook of Fine Pitch Surface Mount Technology; Chip On Board Technologies for Multichip Modules; Ball Grid Array Technology; Flip Chip Technologies; Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies; Electronics Packaging: Design, Materials, Process, and Reliability; Chip Scale Package (CSP): Design, Materials, Process, Reliability, and Applications; Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies, and Microvias for Low Cost, High Density Interconnects. John served as one of the associate editors of the IEEE Transactions on Components, Packaging, and Manufacturing Technology and ASME Transactions, Journal of Electronic Packaging. He also served as general chairman, program chairman, and session chairman, and invited speaker of several IEEE, ASME, ASM, MRS, IMAPS, SEMI, and SMI International conferences. He received a few awards from ASME and IEEE for best papers and outstanding technical achievements, and is an ASME Fellow and an IEEE Fellow. He is listed in American Men and Women of Science and Who’s Who in America.
Product Details
Would you like to update product info or give feedback on images?
|
Customer Reviews
|
Share your thoughts with other customers:
|
||||||||||||||||||||||
|
Most Helpful Customer Reviews
4 of 4 people found the following review helpful:
4.0 out of 5 stars
It's a good text for studying micro-interconnection.,
By A Customer
This review is from: Flip Chip Technologies (Hardcover)
It's a well organized book for expounding flip chip bonding, easy to understand. I like it. but the topic of the parts of new technologies, or high-end industries were not to be enough.
Share your thoughts with other customers: Create your own review
|
|
Inside This Book
(learn more)
First Sentence:
Figure 1.1 is a schematic representation of electronic package hierarchy. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
chip interconnect systems, conductive adhesive bumps, bond pad pattern, compliant bumps, polymer bumps, neighboring interconnections, bump assemblies, fluxless process, heatsink base, damage integral approach, test fault coverage, conductive adhesive paste, global thermal expansion mismatch, wire bumping, yielded chips, flip chip applications, grease thickness, waffle trays, stud bumps, flip chip solder joints, interconnection resistance, conductive adhesive films, flip chip assembly, area array pitch, bump diameter Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Flip-Chip Bonding, Van Nostrand Reinhold, Technology Conference, San Jose, International Conference, Research Devel, Electronic Components Conference, Advanced Packaging Symposium, Seiko Epson, Circuit World, Electrochemical Publications, Solid State Technol, Thin Solid Films, Area of Chip, Epoxy Technology, Flip-Chip System, Introduction Flip, Parameter Polymer, San Diego, Wafer Labor, West Proceedings, Components Hybrid Manufact, International Electronics Packaging Conference, International Symposium New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Figure 1.1 is a schematic representation of electronic package hierarchy. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
chip interconnect systems, conductive adhesive bumps, bond pad pattern, compliant bumps, polymer bumps, neighboring interconnections, bump assemblies, fluxless process, heatsink base, damage integral approach, test fault coverage, conductive adhesive paste, global thermal expansion mismatch, wire bumping, yielded chips, flip chip applications, grease thickness, waffle trays, stud bumps, flip chip solder joints, interconnection resistance, conductive adhesive films, flip chip assembly, area array pitch, bump diameter Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Flip-Chip Bonding, Van Nostrand Reinhold, Technology Conference, San Jose, International Conference, Research Devel, Electronic Components Conference, Advanced Packaging Symposium, Seiko Epson, Circuit World, Electrochemical Publications, Solid State Technol, Thin Solid Films, Area of Chip, Epoxy Technology, Flip-Chip System, Introduction Flip, Parameter Polymer, San Diego, Wafer Labor, West Proceedings, Components Hybrid Manufact, International Electronics Packaging Conference, International Symposium New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
This book cites 63
books:
See all 63 books this book cites
29
books
cite this book:
See all 29 books citing this book
- Microelectronics Packaging Handbook by R.R. Tummala on 4 pages
- Solders and Soldering: Materials, Design, Production, and Analysis for Reliable Bonding by Howard H. Manko in Front Matter, and page 538
- Principles of Electronic Packaging by Donald Seraphim in Front Matter, and page 76
- Thermal Stress and Strain in Microelectronics Packaging (Electrical Engineering) by John Lau on page 76, and page 82
- Handbook Of Tape Automated Bonding by John H. Lau on page 76, and page 485
See all 63 books this book cites
- Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies by John H. Lau on 17 pages
- Microvias: For Low Cost, High Density Interconnects by John H. Lau on 8 pages
- Chip Scale Package: Design, Materials, Process, Reliability, and Applications by John H. Lau on 7 pages
- Handbook of Thick- and Thin-Film Hybrid Microelectronics by Tapan K. Gupta on 6 pages
- Electronic Packaging: Design, Materials, Process, and Reliability by John H. Lau on 4 pages
See all 29 books citing this book
Books on Related Topics
(learn more)
|
Tag this product(What's this?)Think of a tag as a keyword or label you consider is strongly related to this product.
Tags will help all customers organize and find favorite items. |
Sell a Digital Version of This Book in the Kindle Store
If you are a publisher or author and hold the digital rights to a book, you can sell a digital version of it in our Kindle Store.
Learn more
Customer Discussions
|
This product's forum
Active discussions in related forums
Search Customer Discussions
|
Related forums
|
