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Fundamentals of Electrochemical Deposition (The ECS Series of Texts and Monographs) [Hardcover]

Milan Paunovic (Author), Mordechay Schlesinger (Author)
4.7 out of 5 stars  See all reviews (3 customer reviews)


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Hardcover, October 15, 1998 --  
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Fundamentals of Electrochemical Deposition (The ECS Series of Texts and Monographs) Fundamentals of Electrochemical Deposition (The ECS Series of Texts and Monographs) 4.7 out of 5 stars (3)
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Book Description

October 15, 1998 0471168203 978-0471168201 1
It would be difficult to overstate the importance of electrochemical deposition to science and technology in the late twentieth century. If not for modern electrochemical deposition methods developed over the past decade and a half, many of today's technological wonders simply would never have been. From computer hardware to automobiles, medical diagnostics to aerospace, electrochemical deposition now plays a crucial role in an array of key industries. And, if the recent shift from physical to electrochemical techniques in microcircuit manufacturing is any indication, its importance will only continue to grow in the years ahead.

This book offers a wide-ranging, authoritative look at state-of-the-art electrochemical deposition theory and practice. Written by an author team with extensive experience in both industry and academe, it provides a well-rounded introduction to the field for students, as well as a means for professional chemists, engineers, and technicians to expand and sharpen their skills in using the technology. Over the course of 18 independent chapters, Drs. Paunovic and Schlesinger present detailed coverage of the full range of electrochemical deposition processes and technologies, including:
* Metal-solution interphase
* Charge transfer across an interphase
* Formation of an equilibrium electrode potential
* Nucleation and growth of thin films
* Kinetics and mechanisms of electrodeposition
* Electroless deposition
* In situ characterization of deposition processes
* Structure and properties of deposits
* Multilayered and composite thin films
* Interdiffusion in thin film.

Fundamentals of Electrochemical Deposition is an ideal graduate-level textbook for students of electrochemistry and related areas. It is also an indispensable working resource for all professionals who use this technology, including platers and metal finishers.

Fundamentals of Electrochemical Deposition is a comprehensive introduction to one of today's most exciting and rapidly evolving fields of practical knowledge. With the help of examples drawn from a wide range of areas, the authors describe the science and technology behind all electrodeposition methods currently used in industry. Emphasizing the practical concerns of professionals who use this technology, they provide detailed coverage of:
* nIonic solutions, metal surfaces, and metal-solution interphases
* Electrode potential, deposition kinetics, and thin film nucleation
* Electroless and displacement type depositions
* Effects of additives and the science and technology of alloy deposition
* Current distribution during deposition
* In situ and ex situ deposit characterization
* Mathematical modeling in electrochemistry
* Structure, properties of deposits, multilayers, and interdiffusion.


Editorial Reviews

Review

"...an excellent teaching and resource material...it is concise, coherently structures, and easy to read...highly recommended for students, engineers, and researchers in all related fields." (Corrosion, January 2003)

From the Back Cover

It would be difficult to overstate the importance of electrochemical deposition to science and technology in the late twentieth century. If not for modern electrochemical deposition methods developed over the past decade and a half, many of today's technological wonders simply would never have been. From computer hardware to automobiles, medical diagnostics to aerospace, electrochemical deposition now plays a crucial role in an array of key industries. And, if the recent shift from physical to electrochemical techniques in microcircuit manufacturing is any indication, its importance will only continue to grow in the years ahead.

This book offers a wide-ranging, authoritative look at state-of-the-art electrochemical deposition theory and practice. Written by an author team with extensive experience in both industry and academe, it provides a well-rounded introduction to the field for students, as well as a means for professional chemists, engineers, and technicians to expand and sharpen their skills in using the technology. Over the course of 18 independent chapters, Drs. Paunovic and Schlesinger present detailed coverage of the full range of electrochemical deposition processes and technologies, including:
* Metal-solution interphase
* Charge transfer across an interphase
* Formation of an equilibrium electrode potential
* Nucleation and growth of thin films
* Kinetics and mechanisms of electrodeposition
* Electroless deposition
* In situ characterization of deposition processes
* Structure and properties of deposits
* Multilayered and composite thin films
* Interdiffusion in thin film.

Fundamentals of Electrochemical Deposition is an ideal graduate-level textbook for students of electrochemistry and related areas. It is also an indispensable working resource for all professionals who use this technology, including platers and metal finishers.

Fundamentals of Electrochemical Deposition is a comprehensive introduction to one of today's most exciting and rapidly evolving fields of practical knowledge. With the help of examples drawn from a wide range of areas, the authors describe the science and technology behind all electrodeposition methods currently used in industry. Emphasizing the practical concerns of professionals who use this technology, they provide detailed coverage of:
* nIonic solutions, metal surfaces, and metal-solution interphases
* Electrode potential, deposition kinetics, and thin film nucleation
* Electroless and displacement type depositions
* Effects of additives and the science and technology of alloy deposition
* Current distribution during deposition
* In situ and ex situ deposit characterization
* Mathematical modeling in electrochemistry
* Structure, properties of deposits, multilayers, and interdiffusion.

Product Details

  • Hardcover: 312 pages
  • Publisher: Wiley-Interscience; 1 edition (October 15, 1998)
  • Language: English
  • ISBN-10: 0471168203
  • ISBN-13: 978-0471168201
  • Product Dimensions: 9.6 x 6 x 0.8 inches
  • Shipping Weight: 1.2 pounds
  • Average Customer Review: 4.7 out of 5 stars  See all reviews (3 customer reviews)
  • Amazon Best Sellers Rank: #3,153,976 in Books (See Top 100 in Books)

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Average Customer Review
4.7 out of 5 stars (3 customer reviews)
 
 
 
 
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Most Helpful Customer Reviews

5.0 out of 5 stars Good book to have, March 4, 2010
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The book provides very good explainations about all you should know in electrochemical deposition. It may not have as many detials as Modern Electroplating book (by the same authors) but it is easier to read and understand.
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5.0 out of 5 stars Excellent, May 25, 2001
By A Customer
This review is from: Fundamentals of Electrochemical Deposition (The ECS Series of Texts and Monographs) (Hardcover)
The book covers the major features of all kinds of electrochemical deposition and it is a handy book for all those involved in this kind of depostion studies..
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0 of 1 people found the following review helpful:
4.0 out of 5 stars Electrochemical Deposition, May 26, 2001
By A Customer
This review is from: Fundamentals of Electrochemical Deposition (The ECS Series of Texts and Monographs) (Hardcover)
This book being the first of its kind in the industry on electrochemical deposition is very informative and interesting. Copper damanscene being the future for CMP has somwhat made this book a neccessity to all personnel working in the micro electronics industry.

The book gives a good grounding on electrochemical deposition and the underlying parameters that affect deposition.

The only setback is that there is no effort being made to link the findings in the deposition of copper and how it affects the final CMP process.

Being a new and first of its kind this is forgivable.

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Inside This Book (learn more)
First Sentence:
Electrochemical deposition of metals and alloys involves the reduction of metal ions from aqueous, organic, and fused-salt electrolytes. Read the first page
Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
displacement deposition, geometric leveling, anodic partial reaction, catalytic nuclei, electroless copper deposition, cathodic partial reaction, progressive nucleation, coherent deposit, electroless deposition, electroless metal deposition, alloy deposition, electrodeposited metals, partial current density, cathode efficiency, electrodeposited nickel, test electrode, throwing power, mixed potential, electrochemical model, instantaneous nucleation, electrochemical deposition, electrodeposition process, limiting current density, multilayer growth, columnar microstructure
Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Electrochemical Society, Plenum Press, Academic Press, Faraday Soc, Electrochemically Deposited Thin Films, Oxford University Press, Interscience Publishers, Modern Electroplating, Advanced Treatise, Comprehensive Treatise of Electrochemistry, Noyes Publications, Surface Electrochemistry, Dover Publications, Solid State Physics, Statistical Thermodynamics, Theoretical Foundations, University of Windsor
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