Fundamentals of Microsystems Packaging [Hardcover]

Rao Tummala (Author)

Book Description

ISBN-10: 0071371699 | ISBN-13: 978-0071371698 | Publication Date: May 8, 2001 | Edition: 1

LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP

Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find:

*Full coverage of electrical, mechanical, chemical, and materials aspects of each technology
*Easy-to-read schematics and block diagrams
*Fundamental approaches to all system issues
*Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others
*Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes
*Basics of electrical and reliability testing

Editorial Reviews

From the Back Cover

The only book to teach microsystems packaging--written by the field's leading author This is the book that engineers, technicians, and students want—the first to teach microsystems packaging from the ground up. Rao Tummala’s one-stop Fundamentals to Microsystems Packaging covers the field from wafer to systems, including every major contributing technology. It’s the only book to do so. This much-needed tool features:

*A comprehensive tutorial covering every major aspect of microelectronics, photonics, RF, packaging design, assembly, reliability, testing, manufacturing and its relevance to both semiconductors and systems.
*Rigorous coverage of electrical, mechanical, chemical, and materials aspects of each technology
*Easy-to-read schematics and block diagrams
*Fundamental approaches to all system issues
*Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others
*Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes
*Basics of electrical and reliability testing
*Hundreds of explanatory two-color illustrations
*Self-test problems and solutions in every chapter
*Glossary
*The best way to learn microsystems packaging through self-study or in a classroom—and the most comprehensive on-the-job reference

MICROSystems PACKAGING FROM THE GROUND UP

About the Author

Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM.

Product Details

• Hardcover: 967 pages
• Publisher: McGraw-Hill Professional; 1 edition (May 8, 2001)
• Language: English
• ISBN-10: 0071371699
• ISBN-13: 978-0071371698
• Product Dimensions: 9.4 x 7.5 x 1.6 inches
• Shipping Weight: 3.6 pounds
• Average Customer Review: 3.0 out of 5 stars  See all reviews (2 customer reviews)
• Amazon Best Sellers Rank: #154,537 in Books (See Top 100 in Books)

Customer Reviews

Most Helpful Customer Reviews

6 of 8 people found the following review helpful:

1.0 out of 5 stars This book is garbage, October 27, 2003

By A Customer

This review is from: Fundamentals of Microsystems Packaging (Hardcover)

Nothing personal, for those who give more than 2 stars for this book, you are either a friend of the author, got the book for free, or never really review it throroughly. Here are the reason why:
1. Nothing is new in this book that you can get it off the web
2. Equations were given without fully specify its component
3. You can't work the problem in the back of the chapter because there are no materials in the chapter to support it. You need your old engineering book in order to solve these problems
4. Problems were stated unclear and incorrect. For example, he ask to calculate an N-channel MOSFET transistor problem, but the figure he used is a P-channel. It seems like the author either pull these problems out of this behind or took these problems from other engineering books and change some values to make it different, but unfortunately, those values were unworkable.
5. Pretty thick book for a lot of garbage. If I need to work electrical or heat transfer problems, I'll go to my old engineering book at least those authors know their materials.

8 of 17 people found the following review helpful:

5.0 out of 5 stars All About Microsystems Packaging, December 30, 2001

By 

[e-mail] (Worcester, MA USA) - See all my reviews

This review is from: Fundamentals of Microsystems Packaging (Hardcover)

"Fundamentals of Microsystems Packaging" is an informative, well-written textbook, the first to cover this rapidly-evolving technology. Professor Tummala's latest book should appeal to only three groups: those who know a lot about microsystems packaging, those who know something about it, and those who know nothing about it.

Microsystems packaging specialists, who typically focus on one sub-specialty, will find this detailed exposition of the entire field broadening. Non-specialists with some general packaging knowledge will find here all that they need to fully understand and work with the key elements of microsystems packaging. Novices, students, and those in related technical fields will find a well-structured introduction that prepares them to deal with microsystems packaging.

This comprehensive textbook offers to all of the above groups a firm grounding in the diverse disciplines comprising microsystems packaging. Nineteen of the chapters share the title, "Fundamentals of ...". "Fundamental" means "a foundation," and that is what these chapters provide, covering the key elements of topics ranging from semiconductors to systems, including design, processing, materials, manufacture, testing, performance, reliability, thermal management, and environmental considerations.

For the specialist, who must build upon these foundations, each chapter includes a judicious selection of recommended further readings. For the autodidact, the scholar, or the flagellant, there are even homework problems to test your knowledge. Four chapters, covering optoelectronics, MEMS, RF packaging, and wafer-level packaging, lead the venturesome to the borders of today's knowledge, where they might glimpse the promised land, or just gape at the dark forests of ignorance.

Although the text is the child of fifty authors, the logical flow and smooth editing make it a unified work that speaks with one clear voice. Despite their diversity, the 2:1 ratio of academic to practitioner authors makes a good balance of technical rigor and practical experience. Talented illustrators provided a wealth of informative two-color pictures, charts, pictures, and diagrams.

In summary, despite my forty years in microelectronics research, engineering, management, and consulting, I learned new things every time I opened this book.