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Fundamentals of Semiconductor Fabrication [Paperback]

Gary S. May (Author), Simon M. Sze (Author)
1.0 out of 5 stars  See all reviews (4 customer reviews)

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Book Description

April 11, 2003 0471232793 978-0471232797 1
Offers a basic, up-to-date introduction to semiconductor fabrication technology, including both the theoretical and practical aspects of all major steps in the fabrication sequence
Presents comprehensive coverage of process sequences
Introduces readers to modern simulation tools
Addresses the practical aspects of integrated circuit fabrication
Clearly explains basic processing theory

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Customers buy this book with Microelectronic Circuits (The Oxford Series in Electrical and Computer Engineering) $126.99

Fundamentals of Semiconductor Fabrication + Microelectronic Circuits (The Oxford Series in Electrical and Computer Engineering)
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Editorial Reviews

From the Back Cover

This concise introduction to semiconductor fabrication technology covers everything professionals need to know, from crystal growth to integrated devices and circuits. Throughout, the authors address both theory and the practical aspects of each major fabrication step, including crystal growth, silicon oxidation, photolithography, etching, diffusion, ion implantation, and thin film deposition.
  • The book integrates Computer Modeling & Simulation tools throughout.
  • Process simulation is used as a tool for what-if analysis and discussion.
  • Comprehensive coverage of process sequences helps readers connect individual steps into a cohesive whole.

About the Author

Gary S. May, Ph.D. is Executive Assistant to the President and Motorola Foundation Professor of Microelectronics in the School of Electrical and Computer Engineering at the Georgia Institute of Technology. Dr. May was a national Science Foundation national Young Investigator, Georgia Tech?s Outstanding Young Alumnus, received Georgia Tech?s Outstanding Service Award, and was named a Giant of Science by the Quality Education for Minorities network in 2001. He was a member of the NSF Engineering Advisory Committee, served on and chaired the NSF Committee for Equal Opportunity in Science and Engineering, and was Editor-in-Chief for IEEE Transactions of Semiconductor Manufacturing from 1997 to 2001. Dr. May currently serves as chair of the National Advisory Board for the National Society of Black Engineers.

Simon M. Sze, Ph.D. is UMC Chair Professor of National Chiao Tung University, and President of the National Nano Device Laboratories. He has received the IEEE Ebers Award, the Sun Yet-sen Award, the National Science and Technology Award, and the National Chair Professor Award. He is a Life Fellow of IEEE, a member of the Academia Sinica, the Chinese Academy of Engineering, and the US National Academy of Engineering. He has authored or coauthored over 150 technical papers, and has written, edited, and contributed to 24 books. His book Physics of Semiconductor Devices (Wiley 1969, 2nd Ed, 1981) is the most cited work in contemporary engineering and applied science publications (over 12,000 citations from ISI Press).


Product Details

  • Paperback: 320 pages
  • Publisher: Wiley; 1 edition (April 11, 2003)
  • Language: English
  • ISBN-10: 0471232793
  • ISBN-13: 978-0471232797
  • Product Dimensions: 7 x 0.7 x 10 inches
  • Shipping Weight: 1.6 pounds (View shipping rates and policies)
  • Average Customer Review: 1.0 out of 5 stars  See all reviews (4 customer reviews)
  • Amazon Best Sellers Rank: #1,249,553 in Books (See Top 100 in Books)

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Average Customer Review
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8 of 10 people found the following review helpful:
1.0 out of 5 stars Worst Text Book EVER!, June 13, 2005
This review is from: Fundamentals of Semiconductor Fabrication (Paperback)
I'm a student at Georgia Tech, and for some reason the professors there think that they know how to write textbooks. I've seen a lot of bad textbooks, but this one takes the cake. I can easily label this the worst textbook I've ever used. The book is full of errors, and the homework problems are poorly designed as most of the times you have to consult third party sources to solve them (my entire class agrees). Gary May, if you're reading this (and I hope you are), I want to thank you for writing the most disgusting textbook I've ever read. You clearly know what you are talking about, but you clearly don't know how to talk about it or how to teach it. I honestly don't understand how you expect students to learn from this garbage. I understand most people looking to buy this don't have an option as it is class material, but if you do have any option in this purchase I highly recommend you look elsewhere. I'd give this 0 stars if I could.
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1.0 out of 5 stars seriously come on, September 24, 2008
This review is from: Fundamentals of Semiconductor Fabrication (Paperback)
I don't even understand how a textbook like this can be printed with so many errors in it. Even some key equations are riddled with errors that have to be tracked down. It is a major waste of time trying to find where the author went wrong in the example problems. If you can't get the basic algebra correct consistently, why should I trust what you say about anything in this book? If you get stuck with this book for a course I really pity you.
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1.0 out of 5 stars Very poor writing style, November 12, 2007
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This review is from: Fundamentals of Semiconductor Fabrication (Paperback)
Extremely poor teaching tool. Not only are the majority of methods outdated (albeit that is not the authors fault), but the ones that are still being used today are poorly written. The 300 pages of material should have been 600. Gary May should not be writing books; his style is confusing and indirect. I am also very disappointed that Sze's name is on the book. A waste of money.
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Inside This Book (learn more)
Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
extrinsic diffusion, parametric yield, lithographic system, doping distribution, impingement rate, implant damage, resolution enhancement techniques, resist profile, junction depth, input listing, ion beam lithography, exposure tools, dry oxidation, etch rate, implanted ions, functional yield, boron ions, step coverage, optical lithography, boron implantation, silicon ingot, epitaxial process, etch selectivity, lithography process, lithographic methods
Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Electron Devices Meet, Solid State Technol, Bell Syst, Silicon Oxidation, End Deck, Polysilicon Gate-Deck, Range of Implanted Ions, San Jose, Active Net Cmin, Semiconductor Industry Association, Silicon Phosphor Concentration, Aluminum Thickness, Arsenic Dose, Bell Laboratories, Chemical Boron Arsenic Phosphor Net, Silicon Boron Concentration, Year Figure
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