First Sentence:
In all the plasma processes discussed in this book, namely deposition and etching by physical sputtering and by plasma enhanced chemistry, the gaseous environment plays a major role.
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Key Phrases - Statistically Improbable Phrases (SIPs):
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bias evaporation, sputter ejection, hot filament discharge, target sheath, dark space thickness, sputtering yield data, bias sputtering, sheath voltage, anode sheath, secondary electron coefficient, sputtering discharge, cathode sheath, plasma etching system, triode systems, energy transfer function, silicon etch rate, glow discharge processes, plasma potential, space charge sheath, sputtering system, substrate platform, floating substrate, thin film adhesion, glow region, etching species
Key Phrases - Capitalized Phrases (CAPs):
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New York, Academic Press, Solid State Tech, Thin Solid Films, Architecture of the Discharge, Ionized Gases, Thin Film Processes, Bias Techniques, Handbook of Thin Film Technology, Deposition of Multicomponent Materials, John Coburn
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