This volume covers the topic of advanced plasma processing techniques, from the fundamental physics of plasmas to diagnostics, modeling and applications such as etching and deposition for microelectronics. The use of plasmas for patterning on a submicron scale has enabled successive generations of continually smaller transistors, lasers, micromachines, sensors and magnetic read/write heads that have formed the basis of our information age. This volume is the first to give coverage to this broad area of topics in a detailed fashion, especially in the rapidly expanding fields of micro-mechanical machines, photomask fabrication, magnetic data storage and reactor modeling. It provides the reader with a broad array of topics, authored by the leading experts in the field.
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This volume covers the topic of advanced plasma processing techniques, from the fundamental physics of plasmas to diagnostics, modeling and applications such as etching and deposition for microelectronics. The use of plasmas for patterning on a submicron scale has enabled successive generations of continually smaller transistors, lasers, micromachines, sensors and magnetic read/write heads that have formed the basis of our information age. This volume is the first to give coverage to this broad area of topics in a detailed fashion, especially in the rapidly expanding fields of micro-mechanical machines, photomask fabrication, magnetic data storage and reactor modeling. It provides the reader with a broad array of topics, authored by the leading experts in the field.
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Inside This Book
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First Sentence:
Industrial applications of glow discharges have increased tremendously during the last third of the 20th century. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
electron shading, calculated defect density, unalloyed contact resistance, reactive gas glow discharges, spontaneous etch rate, chloride etch products, sidewall charging, thermal wave spectroscopy, etch product formation, ion energy distribution function, mask aspect ratio, mask charging, etch piece, mixed reactor model, etch temperature, chuck temperature, polysilicon sidewalls, selective reactive ion etching, thermal wave signal, chuck power, etch conditions, main etch, plasma passivation, capacitive sources, line edge roughness Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Monte Carlo, Academic Press, Plasma Sources Sci, Solid-State Electron, Sandia National Laboratories, Park Ridge, Surface Damage Induced, Electron Devices, John Wiley, Overview of Plasma Diagnostic Techniques, San Diego, Electron Device Lett, Noyes Publications, Plasma Proc, Solid State Technol, United States Department of Energy, University of Illinois, Lockheed Martin Company, Maxwell Boltzmann, Quantum Electron, Sandia Corporation, Thin Film Processes, Applied Materials, Device Damage During Chemical Vapor Deposition New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Industrial applications of glow discharges have increased tremendously during the last third of the 20th century. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
electron shading, calculated defect density, unalloyed contact resistance, reactive gas glow discharges, spontaneous etch rate, chloride etch products, sidewall charging, thermal wave spectroscopy, etch product formation, ion energy distribution function, mask aspect ratio, mask charging, etch piece, mixed reactor model, etch temperature, chuck temperature, polysilicon sidewalls, selective reactive ion etching, thermal wave signal, chuck power, etch conditions, main etch, plasma passivation, capacitive sources, line edge roughness Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Monte Carlo, Academic Press, Plasma Sources Sci, Solid-State Electron, Sandia National Laboratories, Park Ridge, Surface Damage Induced, Electron Devices, John Wiley, Overview of Plasma Diagnostic Techniques, San Diego, Electron Device Lett, Noyes Publications, Plasma Proc, Solid State Technol, United States Department of Energy, University of Illinois, Lockheed Martin Company, Maxwell Boltzmann, Quantum Electron, Sandia Corporation, Thin Film Processes, Applied Materials, Device Damage During Chemical Vapor Deposition New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
This book cites 29
books:
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6
books
cite this book:
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- Principles of Plasma Discharges and Materials Processing , 2nd Edition by Michael A. Lieberman on 4 pages
- Thin Film Processes by John L. Vossen on page 65, and page 496
- Remote Sensing (Survey report) by Richrd R. Miller on page 204
- Techniques of Vacuum Ultraviolet Spectroscopy by James A. R. Samson on page 203
- Fundamentals of Fourier Transform Infrared Spectroscopy by Brian C. Smith on page 204
See all 29 books this book cites
- Pulsed and Pulsed Bias Sputtering: Principles and Applications by Edward V. Barnat in Back Matter (1), and Back Matter (2)
- Fabrication of GaAs Devices by C. Ashby A. Baca on page 178
- Mechanical Tribology: Materials, Characterization, and Applications by George E. Totten on page 131
- Zinc Oxide Bulk, Thin Films and Nanostructures: Processing, Properties, and Applications by Chennupati Jagadish on page 335
- MEMS and Microstructures in Aerospace Applications by Robert Osiander on page 64
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