This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.
--This text refers to an alternate
Hardcover
edition.
FREE Two-Day Shipping for Students. Learn more |
| |||||||||||||||
Book Description
Product Details
Would you like to update product info or give feedback on images?
|
More About the Author
Discover books, learn about writers, read author blogs, and more.
Customer Reviews
|
There are no customer reviews yet.
|
|||
|
Video reviews
|
Inside This Book
(learn more)
Browse and search another edition of this book.
Browse and search another edition of this book.
First Sentence:
The use of lead (Pb) has been widely accepted in the electronics industry (utilized in a variety of applications for more than five decades), but most notably the use of eutectic tin-lead (Sn-Pb) solders to attach discrete components to printed circuit boards (PCBs). Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
composite solders, solder matrix, solder bath temperature, fillet lifting, compound layer growth, hulk solder, reflow soldering technology, solder candidates, area array components, hoard finish, microscope backscattered electron image, intermetallic compound layer, intermetallic compound particles, thermomechanical fatigue resistance, base metal dissolution, chip carrier pads, accelerated thermal cycle, wave soldering applications, peak reflow temperature, flip chip solder joints, solder reactions, electrode finishes, solderable layer, pasty range, solder microstructure Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, United States, Courtesy of Panasonic, Nepcon West, San Diego, San Jose, Member States, Sri Ag-Cu, Environmental Protection Agency, Technical Conference, European Commission, Courtesy of Sandia National Laboratories, Mount Technol, Acta Metall, International Symposium, Circuits Assem, Matsushita Electric, Courtesy of Universal Instruments Corporation, North American, Las Vegas, Materials Park, New Orleans, Circuit World, Courtesy of Nokia Corp, Lake Buena Vista New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
The use of lead (Pb) has been widely accepted in the electronics industry (utilized in a variety of applications for more than five decades), but most notably the use of eutectic tin-lead (Sn-Pb) solders to attach discrete components to printed circuit boards (PCBs). Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
composite solders, solder matrix, solder bath temperature, fillet lifting, compound layer growth, hulk solder, reflow soldering technology, solder candidates, area array components, hoard finish, microscope backscattered electron image, intermetallic compound layer, intermetallic compound particles, thermomechanical fatigue resistance, base metal dissolution, chip carrier pads, accelerated thermal cycle, wave soldering applications, peak reflow temperature, flip chip solder joints, solder reactions, electrode finishes, solderable layer, pasty range, solder microstructure Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, United States, Courtesy of Panasonic, Nepcon West, San Diego, San Jose, Member States, Sri Ag-Cu, Environmental Protection Agency, Technical Conference, European Commission, Courtesy of Sandia National Laboratories, Mount Technol, Acta Metall, International Symposium, Circuits Assem, Matsushita Electric, Courtesy of Universal Instruments Corporation, North American, Las Vegas, Materials Park, New Orleans, Circuit World, Courtesy of Nokia Corp, Lake Buena Vista New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
21
books
cite this book:
See all 21 books citing this book
- Gigacycle Fatigue in Mechanical Practice (Dekker Mechanical Engineering) by Claude Bathias in Front Matter
- Design of Automatic Machinery (Dekker Mechanical Engineering) by Stephen J. Derby in Front Matter
- Rotordynamics (Dekker Mechanical Engineering) by Agnieszka Muszynska in Front Matter
- Micro Electro Mechanical System Design (Dekker Mechanical Engineering) by James J. Allen in Front Matter
- Engineering Design for Wear, Second Edition, Revised and Expanded (Dekker Mechanical Engineering) by Raymond G. Bayer in Front Matter
See all 21 books citing this book
Books on Related Topics
(learn more)
|
Tag this product(What's this?)Think of a tag as a keyword or label you consider is strongly related to this product.
Tags will help all customers organize and find favorite items. |
Sell a Digital Version of This Book in the Kindle Store
If you are a publisher or author and hold the digital rights to a book, you can sell a digital version of it in our Kindle Store.
Learn more
Customer Discussions
|
This product's forum
Active discussions in related forums
Search Customer Discussions
|
Related forums
|
