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Handbook of Semiconductor Manufacturing Technology [Hardcover]

Yoshio Nishi (Editor), Robert Doering (Editor)
4.0 out of 5 stars  See all reviews (2 customer reviews)


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Handbook of Semiconductor Manufacturing Technology, Second Edition Handbook of Semiconductor Manufacturing Technology, Second Edition 4.5 out of 5 stars (2)
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Book Description

August 9, 2000 0824787838 978-0824787837 1
The Handbook of Semiconductor Manufacturing Technology describes the individual processes and manufacturing control, support, and infrastructure technologies of silicon-based integrated-circuit manufacturing, many of which are also applicable for building devices on other semiconductor substrates. Discussing ion implantation, rapid thermal processing, photomask fabrication, chip testing, and plasma etching, the editors explore current and anticipated equipment, devices, materials, and practices of silicon-based manufacturing. The book includes a foreword by Jack S. Kilby, cowinner of the Nobel Prize in Physics 2000 "for his part in the invention of the integrated circuit."

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Product Details

  • Hardcover: 1157 pages
  • Publisher: CRC Press; 1 edition (August 9, 2000)
  • Language: English
  • ISBN-10: 0824787838
  • ISBN-13: 978-0824787837
  • Product Dimensions: 11 x 8.7 x 2.4 inches
  • Shipping Weight: 6.4 pounds
  • Average Customer Review: 4.0 out of 5 stars  See all reviews (2 customer reviews)
  • Amazon Best Sellers Rank: #2,578,147 in Books (See Top 100 in Books)

 

Customer Reviews

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4.0 out of 5 stars (2 customer reviews)
 
 
 
 
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4 of 4 people found the following review helpful:
4.0 out of 5 stars Get this handbook! Nothing will ever come close to it., May 15, 2001
By 
"coolrunning" (Puchong, Selangor Malaysia) - See all my reviews
This review is from: Handbook of Semiconductor Manufacturing Technology (Hardcover)
I'm new to the semiconductor manufacturing business. Getting this book is definitely the right thing I've done. This book provides all the things i wanted to know about semiconductor manufacturing. With over 1100 pages, this book is hard to resist. It covers almost all the technology required for making semiconductor IC. Even though it does not give much details, but the coverage of the topic is sufficient. In addition, the generousity of the authors to provide ample references at the end of each chapter is amazing. One will have plenty of time to search through the references for further info. I suggest that people who are in the semiconductor manufacturing field to get their hands on it. One thing that can be improved regarding to the presentation of this handbook, is the way the diagrams are displayed. Maybe the publisher should consider printing them in glossy paper as some diagrams looks very poor as if they just come out from the photocopy machine.
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0 of 3 people found the following review helpful:
4.0 out of 5 stars Get this handbook! Nothing will ever come close to it., May 16, 2001
By A Customer
This review is from: Handbook of Semiconductor Manufacturing Technology (Hardcover)
I'm new to the semiconductor manufacturing business. Getting this book is definitely the right thing I've done. This book provides all the things i wanted to know about semiconductor manufacturing. With over 1100 pages, this book is hard to resist. It covers almost all the technology required for making semiconductor IC. Even though it does not give much details, but the coverage of the topic is sufficient. In addition, the generousity of the authors to provide ample references at the end of each chapter is amazing. One will have plenty of time to search through the references for further info. I suggest that people who are in the semiconductor manufacturing field to get their hands on it. One thing that can be improved regarding to the presentation of this handbook, is the way the diagrams are displayed. Maybe the publisher should consider printing them in glossy paper as some diagrams looks very poor as if they just come out from the photocopy machine.
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Inside This Book (learn more)
First Sentence:
The silicon MOSFET has emerged as the ubiquitous active element for silicon VLSI integrated circuits. Read the first page
Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
gap fill performance, fab throughput, polysilicon film thickness, time dependent reflectivity, failure site isolation, killer probability, diazoquinone moiety, retaining ring carrier, tall stocker, wafer tower, optical photomasks, dependent uptime, oxygen precipitation kinetics, planarization length, plain silicon wafer, polyimide nanofoams, wafer emissivity, binary photomasks, oxygen incorporation level, scalpel mask, other advanced metals, polished monocrystalline silicon wafers, image placement errors, oxygen incorporation behavior, pattern placement errors
Key Phrases - Capitalized Phrases (CAPs): (learn more)
Electrochem Soc, Vac Sci Technol, Appl Phys, New York, Materials Research Society, Mat Res Soc Symp Proc, Santa Clara, San Francisco, Mater Res Soc, John Wiley, Round Rock, Texas Instruments, International Reliability Physics Symposium Proceedings, Academic Press, Research Inc, Tech Digest, New Jersey, Phys Rev, Kluwer Academic Publishers, Semiconductor International, Trans Elec Dev, International Conference, Usage Gal, San Diego, Semiconductor Industry Association
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