High Performance Flip Chip Process Technologies [Hardcover]

Daniel Baldwin (Author)

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Book Description

ISBN-10: 0071468951 | ISBN-13: 978-0071468954 | Publication Date: December 2006 | Edition: 1

Understand and utilize the latest flip chip technology

High Performance Flip Chip Technologies fully covers the new lowcost flip chip processes and material systems that make the manufacture of miniature consumer electronic devices possible.

#outer_postBodyPS { display: none; } #psGradient { display: none; } #psPlaceHolder { display: none; } #psExpand { display: none; } Understand and utilize the latest flip chip technology

High Performance Flip Chip Technologies fully covers the new lowcost flip chip processes and material systems that make the manufacture of miniature consumer electronic devices possible.

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About the Author

Daniel Baldwin, Ph.D. is an associate professor of mechanical engineering at the Georgia Institute of Technology where he heads the Low Cost Flip Chip Packaging Research Center.

Product Details

Hardcover: 500 pages
Publisher: McGraw-Hill Professional; 1 edition (December 2006)
Language: English
ISBN-10: 0071468951
ISBN-13: 978-0071468954
Amazon Best Sellers Rank: #10,243,682 in Books (See Top 100 in Books)

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