High Performance Printed Circuit Boards [Hardcover]

Charles A. Harper (Author)

Book Description

ISBN-10: 0070267138 | ISBN-13: 978-0070267138 | Publication Date: February 25, 2000 | Edition: 1

• A guided tour through the new generation of high-performance printed circuit boards (PCBs) and ceramic substrates
• Packed with leading-edge information, including data, details and guidelines on microvias, built-up multi-layers, high-density boards, and advanced ceramic substrates
• Covers environmentally safe PCB materials and processes
• Essential for electronics engineers, designers, and technicians--plus manufacturing and mechanical engineers

Editorial Reviews

About the Author

Charles A. Harper is president of Technology Seminars, Inc., an organization devoted to presenting seminars on electronic packaging and related subjects to the electronics industry. He is a graduate of The John Hopkins University School of Engineering , Baltimore, MD., and a past member of the engineering faculty of The Johns Hopkins University. He is active in numerous professional societies, including the International Microelectronics and Packaging Society (of which he is a past president), the National Electronic Packaging Conference (NEPCON), and the Institute of Electrical and Electronics Engineers. He is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and a member of the Editorial Advisory Board of Electronic Packaging and Production magazine.

Product Details

• Hardcover: 512 pages
• Publisher: McGraw-Hill Professional; 1 edition (February 25, 2000)
• Language: English
• ISBN-10: 0070267138
• ISBN-13: 978-0070267138
• Product Dimensions: 9.1 x 6.4 x 1.6 inches
• Shipping Weight: 2.3 pounds
• Amazon Best Sellers Rank: #2,053,723 in Books (See Top 100 in Books)