Copper interconnect technology is expected to be a key component in the quest to create more powerful CPUs and memory chips. This text examines the role of copper in future interconnects, presents the range of problems involved, and explains how the solutions are being found.
Contents
- Introduction
- Interconnect issues
- Copper deposition
- Copper patterning
- Interlayer dielectrics
- Cu/ILD barriers
- Current practice
- Index
