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Interlayer Dielectrics for Semiconductor Technologies (Academic Press)
 
 
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Interlayer Dielectrics for Semiconductor Technologies (Academic Press) [Hardcover]

Shyam P Muraka (Author), Moshe Eizenberg (Editor), Ashok K Sinha (Editor)

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Book Description

January 13, 2004 0125112211 978-0125112215 1
Semiconductor technologies are moving at such a fast pace that new materials are needed in all types of application. Manipulating the materials and their properties at atomic dimensions has become a must. This book presents the case of interlayer dielectrics materials whilst considering these challenges.

Interlayer Dielectrics for Semiconductor Technologies cover the science, properties and applications of dielectrics, their preparation, patterning, reliability and characterisation, followed by the discussion of different materials including those with high dielctric constants and those useful for waveguide applications in optical communications on the chip and the package.

* Brings together for the FIRST time the science and technology of interlayer deilectrics materials, in one volume
* written by renowned experts in the field
* Provides an up-to-date starting point in this young research field.

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Editorial Reviews

Book Description

Presents the Science and Technology of ILD materials

About the Author

By Shyam P Muraka

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Inside This Book (learn more)
First Sentence:
The last few decades are frequently described as the solid-state electronics revolution era, the most significant technological revolution since the industrial revolution of the nineteenth century. Read the first page
Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
aerogel films, reliability for advanced interconnects, sintered xerogel, xerogel materials, xerogel films, pore wall density, average film density, precursor gas flow, porous silica films, porous dielectrics, minimum solid area, sintered films, copper diffusion barrier, cap deposition, damascene architecture, high etch selectivity, damascene structure, atomic layer deposition, interface reliability, biaxial modulus, hydrogen silsesquioxane, inorganic dielectrics, dense dielectrics, trench etch, resist strip
Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Thin Solid Films, International Interconnect Technology Conference, Advanced Metallization Conference, International Electron Devices Meeting Technical Digest, Academic Press, Elsevier Inc, Marcel Dekker, Solid State Technol, Rensselaer Polytechnic Institute, International Conference, Materials Research Society, Semiconductor Industry Association, Polymer-Solid Interfaces, San Diego, Technology Digest of Technical Papers, Dow Chemical, Electronic Packaging Materials Science, Lightwave Technol, Colloid Interface Sci, Park Ridge, Van Hove, Institute of Physics Publishing, John Wiley, Porosity Fig
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