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An Introduction to Heat Pipes: Modeling, Testing, and Applications (Thermal Management of Microelectronic and Electronic System Series)
 
 
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An Introduction to Heat Pipes: Modeling, Testing, and Applications (Thermal Management of Microelectronic and Electronic System Series) [Hardcover]

G. P. Peterson (Author)

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Book Description

September 22, 1994 047130512X 978-0471305125 1
Your complete resource on heat pipe operation, behavior, performance characteristics, and limitations

This book is designed to help students, operations engineers, and mechanical and electrical engineers in the electronic packaging industry grasp the principles of operation for a wide range of heat pipes. Packed with examples and design information, it takes you through the background and historical development of heat pipes, discusses the interfacial phenomena that govern their operational characteristics, and presents the fundamental operating principles and limitations of both heat pipes and thermosyphons.

Along with detailed presentations of the governing physical phenomena involved, this comprehensive guide features extensive coverage of:
* The background physics of fluids, their behavior in heat pipes, and associated interfacial phenomena
* Heat pipe design methodologies and manufacturing considerations
* Applications for cooling both electrical and mechanical systems
* The full range of heat pipe classifications, including rotating and revolving, micro, cryogenic, and variable conductance heat pipes, as well as thermal diodes and switches


This book provides all the information and guidance you need to increase your understanding of these innovative devices and to begin to apply them to the thermal control of electronic devices and components.

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Editorial Reviews

From the Publisher

Commences with the background and historical development of heat pipes and their relative advantages, followed by a discussion of interfacial phenomena governing the operational properties and basic operating principles and limits of heat pipes and thermosyphons. Features expansive coverage regarding modeling of heat pipe performance. Describes such heat pipes as revolving, micro, cryogenic, variable conductance as well as thermal diodes and switches. Concludes with commentary on recent heat pipes' applications to the thermal control of electronic equipment.

From the Back Cover

Your complete resource on heat pipe operation, behavior, performance characteristics, and limitations

This book is designed to help students, operations engineers, and mechanical and electrical engineers in the electronic packaging industry grasp the principles of operation for a wide range of heat pipes. Packed with examples and design information, it takes you through the background and historical development of heat pipes, discusses the interfacial phenomena that govern their operational characteristics, and presents the fundamental operating principles and limitations of both heat pipes and thermosyphons.

Along with detailed presentations of the governing physical phenomena involved, this comprehensive guide features extensive coverage of:

  • The background physics of fluids, their behavior in heat pipes, and associated interfacial phenomena
  • Heat pipe design methodologies and manufacturing considerations
  • Applications for cooling both electrical and mechanical systems
  • The full range of heat pipe classifications, including rotating and revolving, micro, cryogenic, and variable conductance heat pipes, as well as thermal diodes and switches

This book provides all the information and guidance you need to increase your understanding of these innovative devices and to begin to apply them to the thermal control of electronic devices and components.


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Inside This Book (learn more)
First Sentence:
The initial formulation of the heat pipe concept can be traced to the patents of A. M. Perkins and J. Perkins in the mid-1800s (King, 1931; Perkins and Buck, 1892). Read the first page
Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
rotating heat pipes, cryogenic heat pipes, wicking structure, maximum heat transport capacity, plain ungrooved wafer, maximum chip temperature, heat pipe array, heat pipe heat sink, evaporator heat flux, capillary pumping pressure, heat pipe performance, inertial pressure gradient, heat pipe theory, heat pipe applications, condenser region, intrinsic meniscus, capillary limitation, heat pipes operating, heat pipe operation, type heat pipe, maximum capillary pressure, conductance heat pipes, powder wick, entrainment limit, variable conductance heat pipe
Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Heat Pipe Conf, American Society of Mechanical Engineers, Los Alamos, Journal of Heat Transfer, Final Report, Palo Alto, International Journal of Heat Mass Transfer, Naval Postgraduate School, Greek Symbols, Exp Data, Heat Pipe Symp, Journal of Engineering Physics, Thermophysics Conference, Tsukuba Science City, Wright-Patterson Air Force Base, Closed Two-Phase Thermosyphon, Hughes Aircraft Company, Thermionic Electrical Power Generation, University College of Swansea, West Germany, Annular Two-Phase Flow, Applied Mechanics Review, Furukawa Review, Georgia Institute of Technology
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