Provides a nontechnical introduction to the exciting field of micro-electromechanical systems (MEMS) that describe in detail the materials used in producing MEMS-including silicon, polymers, and glass and quartz substrates-as well as MEMS design and fabrication for nozzles, pressure and inertial sensors, valves, displays, and other applications. DLC: Microelectromechanical systems.
An Introduction to Microelectromechanical Systems Enginee...
and over one million other books are available for Amazon Kindle.
Learn more
FREE Two-Day Shipping for Students. Learn more |
| ||||||||||||||||||||||||
|
There is a newer edition of this item:
|
Book Description
Special Offers and Product Promotions
- Buy $50 in qualifying physical textbooks, get $5 in Amazon MP3 Credit. Here's how (restrictions apply)
Frequently Bought Together
Editorial Reviews
About the Author
Nadim Maluf is vice president of New Focus, Inc. and a consulting professor of electrical engineering at Stanford University. A best-selling author in the area of MEMS technology, Dr. Maluf earned his Ph.D. in electrical engineering at Stanford University. Kirt Williams is a MEMS consultant based in California's Silicon Valley. Formerly, he was a member of the technical staff at Agilent Technologies. He received his Ph.D. and M.S. in electrical engineering from the University of California at Berkeley.
Product Details
Would you like to update product info or give feedback on images?
|
More About the Author
Discover books, learn about writers, read author blogs, and more.
Customer Reviews
|
Share your thoughts with other customers:
|
||||||||||||||||||||||
|
Most Helpful Customer Reviews
13 of 13 people found the following review helpful:
5.0 out of 5 stars
Excellent Introduction to MEMS,
By W J Karl (Munich, Germany) - See all my reviews
This review is from: An Introduction to Microelectromechanical Systems Engineering (Hardcover)
An excellent non-technical introduction to the subject of Micromechanical Systems (MEMS). Nadim Maluf manages to cover the most important technical and economical issues of this broad topic with outstanding clarity and brevity. The MEMS market, materials and common transducer effects are presented as well as fundamental microfabrication/ -machining techniques and device packaging aspects. Emphasis is on explaining the working principles and fabrication of diverse microsensors and microactuators by case studies of commercially available systems (Ink Jet, Pressure Sensor, Flow Sensor, Radiation Sensor, Accelerometer, Gyroscope, Gas Sensor, Microphone, Microvalve and Micromirror) and emerging devices (DNA Amplification and Analysis, RF Switch, Micromechanical Resonator and Filter, Micropump, Optical Switches and Grating Light Valve, Thermomechanical Data Storage). Great read, fantastic illustrations and a wealth of well selected references for further reading.
9 of 9 people found the following review helpful:
5.0 out of 5 stars
Brief and to the point,
By "ago2" (Ithaca, NY United States) - See all my reviews
This review is from: An Introduction to Microelectromechanical Systems Engineering (Hardcover)
I am working in the MEMS area, and found lots of useful facts and recommendations in this book. It does not go into too much theoretical detail, but has a "cook book" style. Good for a general introduction to MEMS.
11 of 12 people found the following review helpful:
5.0 out of 5 stars
Excellent introduction to MEMS,
By
This review is from: An Introduction to Microelectromechanical Systems Engineering (Hardcover)
A very useful book for someone with even little or no background in semiconductor processing.Amazingly logical explanations and very addicting for a technical book !
Share your thoughts with other customers: Create your own review
|
|
Inside This Book
(learn more)
First Sentence:
sensor in the engine compartment helped the engine's electronic control unit maintain, at the location's high altitude, the proper proportions in the mixture of air and fuel. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
silicon nitride plate, micromachined valves, using standard lithography, silicon dioxide mask, silicon fusion bonding, chemomechanical polishing, piezoresistive coefficients, aluminum bond pads, micromechanical structures, micromechanical resonators, polysilicon heater, integrated circuit industry, deep reactive ion etching, micromachined components, electrostatic actuation, stitch bond, electrical interconnects, micromachined sensors, package substrate, electrical pins, silicon nitride layer, capacitive sensing, wet etchants, anodic bonding, sacrificial layer Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Integrated Sensors, Hilton Head Island, Redwood Microsystems, Robert Bosch, Courtesy of Lucas, Stanford University, Daimler Benz, San Jose, Alloy Company, Analog Devices, Interconnection Handbook, San Diego, Scientific American, University of California, Los Angeles, Palo Alto, University of Michigan, Academic Press, Electron Devices, Menlo Park, Microelectromechanical Systems Engineering Table, San Leandro, Solid State Physics, United Kingdom New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
sensor in the engine compartment helped the engine's electronic control unit maintain, at the location's high altitude, the proper proportions in the mixture of air and fuel. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
silicon nitride plate, micromachined valves, using standard lithography, silicon dioxide mask, silicon fusion bonding, chemomechanical polishing, piezoresistive coefficients, aluminum bond pads, micromechanical structures, micromechanical resonators, polysilicon heater, integrated circuit industry, deep reactive ion etching, micromachined components, electrostatic actuation, stitch bond, electrical interconnects, micromachined sensors, package substrate, electrical pins, silicon nitride layer, capacitive sensing, wet etchants, anodic bonding, sacrificial layer Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Integrated Sensors, Hilton Head Island, Redwood Microsystems, Robert Bosch, Courtesy of Lucas, Stanford University, Daimler Benz, San Jose, Alloy Company, Analog Devices, Interconnection Handbook, San Diego, Scientific American, University of California, Los Angeles, Palo Alto, University of Michigan, Academic Press, Electron Devices, Menlo Park, Microelectromechanical Systems Engineering Table, San Leandro, Solid State Physics, United Kingdom New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
This book cites 37
books:
See all 37 books this book cites
2
books
cite this book:
- Solid State Physics: Advances in Research and Applications, Vol. 32 by Henry Ehrenreich on page 37, page 39, and page 199
- Electronic Packaging: Design, Materials, Process, and Reliability by John H. Lau on page 235, and page 237
- Introduction to Solid State Physics by Charles Kittel on page 39, and page 199
- Micromachined Transducers Sourcebook by Gregory T. Kovacs on page 85, and page 200
- Sensors Handbook by Sabrie Soloman on page 159
See all 37 books this book cites
- Optics of Quantum Dots and Wires (Artech House Solid-State Technology Library) by Garnett W. Bryant in Back Matter
- Introduction to Instrumention, Sensors and Process Control (Artech House Sensors Library) by William C. Dunn in Back Matter
Books on Related Topics
(learn more)
|
What Other Items Do Customers Buy After Viewing This Item?
Suggested Tags from Similar Products(What's this?)Be the first one to add a relevant tag (keyword that's strongly related to this product).
|
Customer Discussions
|
This product's forum
Active discussions in related forums
Search Customer Discussions
|
Related forums
|
![[Start the discussion]](http://g-ecx.images-amazon.com/images/G/01/x-locale/communities/discussion_boards/start-new-discussion-sec._V192250339_.gif){kind=small}
