Introduction to Microelectronic Fabrication: Volume 5 of Modular Series on Solid State Devices (2nd Edition) [Paperback]

Richard C. Jaeger (Author)

Book Description

Publication Date: October 27, 2001 | ISBN-10: 0201444941 | ISBN-13: 978-0201444940 | Edition: 2

This introductory book assumes minimal knowledge of the existence of integrated circuits and of the terminal behavior of electronic components such as resistors, diodes, and MOS and bipolar transistors. It presents to readers the basic information necessary for more advanced processing and design books. Focuses mainly on the basic processes used in fabrication, including lithography, oxidation, diffusion, ion implementation, and thin film deposition. Covers interconnection technology, packaging, and yield. Appropriate for readers interested in the area of fabrication of solid state devices and integrated circuits.

Editorial Reviews

From the Back Cover

Introduction to Microelectronic Fabrication, Second Edition, by Richard C. Jaeger, is a concise survey of the most up-to-date techniques in the field. It is devoted exclusively to processing and is highlighted by careful explanations, clean, simple language, and numerous fully solved example problems.

The second edition includes an entirely new chapter on MEMS, as well as substantial modifications to the chapters on MOS and bipolar process integration. Also included is new or expanded coverage of lithography and exposure systems, trench isolation, chemical mechanical polishing, shallow junctions, transient enhanced diffusion, copper Damascene processes and process simulation.

Excerpt. © Reprinted by permission. All rights reserved.

The spectacular advances in the development and application of integrated circuit (IC) technology have led to the emergence of microelectronics process engineering as an independent discipline. Additionally, the pervasive use of integrated circuits requires a broad range of engineers in the electronics and allied industries to have a basic understanding of the behavior and limitations of ICs. One of the goals of this book is to address the educational needs of individuals with a wide range of backgrounds.

This text presents an introduction to the basic processes common to most IC technologies and provides a base for understanding more advanced processing and design courses. In order to contain the scope of the material, we deal only with material related to silicon processing and packaging. The details of many problems specifically related to VLSI/ULSI fabrication are left to texts on advanced processing, a4ough problem areas are mentioned at various points in this text, and goals of the international Technology Roadmap for Semiconductors are discussed as appropriate.

Chapter 1 provides an overview of IC processes, and Chapters 2-6 then focus on the basic steps used in fabrication, including lithography, oxidation, diffusion, ion implantation and thin film deposition, and etching. Interconnection technology, packaging, and yield are covered in Chapters 7 and 8. It is important to understand interactions between process design, device design, and device layout. For this reason, Chapter 9 and 10 on MOS and bipolar process integration have been included. Chapter 11 provides a brief introduction to the exciting area of Microelectromechanical Systems (MEMS).

Major changes in the second edition of this text include new or expanded coverage of lithography and exposure systems, trench isolation, chemical mechanical polishing, shallow junctions, transient-enhanced diffusion, copper Damescene processes, and process simulation. The chapters on MOS and bipolar process integration have been substantially modified, and the chapter on MEMS is entirely new. The problem sets have been expanded, and additional information on measurement techniques has been included.

The text evolved from notes originally developed for a course introducing seniors and beginning graduate students to the fabrication of solid-state devices and integrated circuits. A basic knowledge of the material properties of silicon is needed, and we use Volume I of this Series as a companion text. An introductory knowledge of electronic components such as resistors, diodes, and MOS and bipolar transistors is also useful.

The material in the book is designed to be covered in one semester. In our case, the microelectronics fabrication course is accompanied by a corequisite laboratory. The students design a simple device or circuit based upon their individual capability, and the designs are combined on a multiproject polysilicon gate NMOS chip. Design, fabrication, and testing are completed within the semester. Students from a variety of disciplines, including electrical, mechanical, chemical, and materials engineering; computer science; and physics, are routinely enrolled in the fabrication classes.

Before closing, I must recognize a number of other books that have influenced the preparation of this text. These include The Theory and Practice of Microelectronics and VLSI Fabrication Principles by S. K. Ghandi, Basic Integrated Circuit Engineering by D. J. Hamilton and W.G. Howard, Integrated Circuit Engineering by A.H. Glaser and G.E. Subak-Sharpe, Microelectronic Processing and Device Design by R.A. Colclaser, Semiconductor Devices—Physics and Technology by S.M. Sze, Semiconductor Integrated Circuit Processing Technology by W.R. Runyon and K.E. Bean, and The Science and Engineering of Microelectronic Fabrication by Stephen A. Campbell.

Thanks also go to the many colleagues who have provided suggestions and encouragement for the new edition and especially to our laboratory manager Charles Ellis who has been instrumental in molding the laboratory sections of our course. RICHARD C. JAEGER
Auburn, Alabama

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Product Details

• Paperback: 316 pages
• Publisher: Prentice Hall; 2 edition (October 27, 2001)
• Language: English
• ISBN-10: 0201444941
• ISBN-13: 978-0201444940
• Product Dimensions: 9.2 x 7 x 0.5 inches
• Shipping Weight: 10.4 ounces (View shipping rates and policies)
• Average Customer Review: 4.0 out of 5 stars  See all reviews (6 customer reviews)
• Amazon Best Sellers Rank: #234,062 in Books (See Top 100 in Books)

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Customer Reviews

Most Helpful Customer Reviews

23 of 25 people found the following review helpful:

5.0 out of 5 stars Excellent Book for begineers and practicing engineers, July 19, 1998

By A Customer

This review is from: Introduction to Microelectronic Fabrication (Modular Series on Solid State Devices, Vol 5) (Paperback)

It is an excellent book for beginners who need a good understanding of the basic unit processes associated with a standard microelectronic foundry. It gives a quick reference to almost everything in modern processing and refers to a variety of textbooks and journals for further information. In summary, this is the book you must have if you are in the semiconductor profession and require a quick but useful reference to almost everything in the business.

2 of 2 people found the following review helpful:

3.0 out of 5 stars Almost adequate, November 21, 2005

By 

Bubbium Oxidium (Sterling, VA USA) - See all my reviews

This review is from: Introduction to Microelectronic Fabrication: Volume 5 of Modular Series on Solid State Devices (2nd Edition) (Paperback)

Book is seriously lacking required information to solve the examples let alone the problems. For example chapter six's first example is 6.2. What happened to 6.1? The equation for mean free path (6.6), what is p? Is it the same as P in equation (6.5)? Who knows since there is no example or explanation. Attempting to get the same reults in the text become time consuming and frustrating because all the required information is absent. The book is lacking detail. Avoid it at all possible costs. Hey anyone out there thinking they can write a better book than this go for it. This one needs to be put off the marketplace.

3.0 out of 5 stars Solid information, February 7, 2010

By 

J. Chien "Enginerd" (California) - See all my reviews
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Amazon Verified Purchase

This review is from: Introduction to Microelectronic Fabrication: Volume 5 of Modular Series on Solid State Devices (2nd Edition) (Paperback)

I bought this textbook for a graduate level mechanical engineering course. The material in there is solid. The explanations are not always self-evident (i.e. I cannot understand all of the material without lecture to clarify the material), but all of the information is there.