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Joining Processes: An Introduction
 
 
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Joining Processes: An Introduction [Paperback]

David Brandon (Author), Wayne D. Kaplan (Author)

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Book Description

July 8, 1997 0471964883 978-0471964889 1
Joining Processes An Introduction David Brandon and Wayne D. Kaplan Technion, Israel Institute of Technology, Israel This is an introductory text for students of materials science and engineering interested in the scientific background to the joining and assembly of components in engineering systems. The principles of joining and the common methods employed to achieve a reliable joint are covered in chapters that all conclude with a summary of the points covered, and a set of problems for individual study, or class discussion. In the first chapters, thorough introductory overviews are given of firstly, the mechanical, chemical and physical phenomena related to surfaces, contacts and joins. In subsequent chapters, any necessary metallurgical or chemical background is adequately covered to enable students to understand the basic principles of a variety of joining methods, microelectronic devices and vacuum assemblies. Contents: Introduction; Surface Science; The Mechanics of Joining; Mechanical Bonding; Welding; Weld Metallurgy; Soldering and Brazing; Metal-ceramic Joints and Diffusion Bonding; Adhesives; Vacuum Seals; Micro-electronic Packaging.

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"This is a very informative book which groups together a number of varied topics." --Assembly Automation, Vol 20/2, 2000

From the Back Cover

Joining Processes An Introduction David Brandon and Wayne D. Kaplan Technion, Israel Institute of Technology, Israel This is an introductory text for students of materials science and engineering interested in the scientific background to the joining and assembly of components in engineering systems. The principles of joining and the common methods employed to achieve a reliable joint are covered in chapters that all conclude with a summary of the points covered, and a set of problems for individual study, or class discussion. In the first chapters, thorough introductory overviews are given of firstly, the mechanical, chemical and physical phenomena related to surfaces, contacts and joins. In subsequent chapters, any necessary metallurgical or chemical background is adequately covered to enable students to understand the basic principles of a variety of joining methods, microelectronic devices and vacuum assemblies. Contents: Introduction; Surface Science; The Mechanics of Joining; Mechanical Bonding; Welding; Weld Metallurgy; Soldering and Brazing; Metal-ceramic Joints and Diffusion Bonding; Adhesives; Vacuum Seals; Micro-electronic Packaging.

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Inside This Book (learn more)
First Sentence:
The joining and assembly of engineering compounds is not usually treated in a single, introductory text intended for engineering students. Read the first page
Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
thermoelastic mismatch, mechanical joining systems, rivetted joint, theoretical fracture strength, welding cycle, weld pool, molten filler metal, vacuum assemblies, graded seal, eutectoid temperature, ductile component, microstructural stability, weld cycle, residual stress pattern, true contact area, weld geometry, elastomeric adhesives, plastic constraint, austenite grain boundaries, brazing alloys, welded zone, spreading force, brittle component, lock seam, general yielding
Key Phrases - Capitalized Phrases (CAPs): (learn more)
Metals Handbook, John Wiley, New York, Physical Metallurgy of Welding, Von Mises, Further Reading, Materials Park, Taylor Lyman, American Society of Metals, American Society For Metals, Metals Park, Third Edition, Book Company, Cambridge University Press, Eighth Edition, Sons Inc, Butterworth-Heinemann Ltd, Fourth Edition, Plenum Press, Second Edition, Surface Science Techniques
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