Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.
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Editorial Reviews
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From the reviews: Praise for P.S. Ho, J. Leu, and W.W. Lee, Ed's, Low Dielectric Constant Materials for IC Applications Electrical Insulation Magazine "Because this volume contains an excellent overview of the current research and issues with low-k dielectric materials for IC applications along with comprehensive practical information, researches, material scientists, and polymer engineers working in the area of microelectronics will find this book a very valuable addition to their library." "This text addresses the latest advances in low-k materials, thin film characterization, integration into copper interconnection processing, and reliability for microelectronics applications. … Because this volume contains an excellent overview of the current research and issues with low-k dielectric materials for IC applications along with comprehensive practical information, researchers, material scientists, and polymer engineers working in the area of microelectronics will find this book a very valuable addition to their library." (IEEE Electrical Insulation Magazine, Vol. 20 (2), March/April, 2004) "This book addresses issues on the development, characterization and integration of low dielectric constant (k) materials for advanced on-chip interconnects. … this book illustrates in a comprehensive way the technological challenges brought by the introduction of low-k materials into semiconductor manufacturing. … Being intended to researchers and engineers active in the field of semiconductor processing, it can be used as an introductory book … . Highly appreciated." (Jean - Francois de Marneffe, Physicalia, Vol. 25 (4), 2003)
From the Back Cover
Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.
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First Sentence:
As integrated circuit dimensions continue to decrease, RC delay, crosstalk noise and power dissipation of the interconnect structure become limiting factors for ultra-large-scale integration of integrated circuits. Read the first page Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Materials Research Society, Plenum Press, Solid Films, Academic Press, Park Ridge, Santa Clara, John Wiley, Marcel Dekker, Noyes Publications, San Diego, Thin Solid Filins, Boca Raton, Dry Process, Metallized Plastics, Polymer Interfacial Interactions, Polymer Preprints, Spring Meeting New!
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Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
As integrated circuit dimensions continue to decrease, RC delay, crosstalk noise and power dissipation of the interconnect structure become limiting factors for ultra-large-scale integration of integrated circuits. Read the first page Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Materials Research Society, Plenum Press, Solid Films, Academic Press, Park Ridge, Santa Clara, John Wiley, Marcel Dekker, Noyes Publications, San Diego, Thin Solid Filins, Boca Raton, Dry Process, Metallized Plastics, Polymer Interfacial Interactions, Polymer Preprints, Spring Meeting New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
This book cites 20
books:
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- Plasma Polymerization by H. Yasuda on page 118, and page 165
- Infrared Characteristic Group Frequencies by George Socrates on page 21
- Noise in Semiconductor Devices: Modeling and Simulation (Springer Series in Advanced Microelectronics) by Fabrizio Bonani in Front Matter
- Ferroelectric Memories by James F. Scott in Front Matter
- Physics of Semiconductor Devices by Vikram Kumar on page 165
See all 20 books this book cites
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