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MEMS and MOEMS Technology and Applications (SPIE Press Monograph Vol. PM85)
 
 
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MEMS and MOEMS Technology and Applications (SPIE Press Monograph Vol. PM85) [Hardcover]

P. Rai-Choudhury (Author, Editor)
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Book Description

0819437166 978-0819437167 December 1, 2000
Cost, size, speed, weight, and precision are driving the miniaturization of mechanical systems. This book presents a detailed look at two micromachining technologies that have evolved from the integrated circuits industry: MEMS (micro-electromechanical systems) and MOEMS (micro systems with a strong optical component). Useful as a professional reference, technology user's guide, and as a textbook.

Contents

- Preface
- MEMS/MOEMS Technology Capabilities and Trends
- Operation and Design of MEMS/MOEMS Devices
- Optical Microsystem Modeling and Simulation
- The Digital Micromirror Device: A Micro-Optical Electromechanical Device for Display Applications
- Optical Waveguides and Silicon-Based Micromachined Architectures
- Silicon Micromachines in Optical Communications Networks: Tiny Machines for Large Systems
- Assembly and Test for MEMS and Optical MEMS
- MEMS, Microsystems, Micromachines: Commercializing an Emergent Disruptive Technology
- Index


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Product Details

  • Hardcover: 528 pages
  • Publisher: SPIE Publications (December 1, 2000)
  • Language: English
  • ISBN-10: 0819437166
  • ISBN-13: 978-0819437167
  • Product Dimensions: 10.2 x 7.2 x 1.4 inches
  • Shipping Weight: 2.4 pounds (View shipping rates and policies)
  • Average Customer Review: 4.0 out of 5 stars  See all reviews (1 customer review)
  • Amazon Best Sellers Rank: #1,843,617 in Books (See Top 100 in Books)

More About the Author

Jan G. Korvink is a Professor for Microsystems Engineering at the University of Freiburg in South Germany, where he leads the Laboratory for Microsystem Simulation.

He obtained his M.Sc. in mechanical engineering (specialising in computational mechanics) from the University of Cape Town in 1987, and his Ph.D. in applied computer science from the ETH Zurich in 1993. After his graduate studies, he joined the Physical Electronics Laboratory of the ETH Zurich, where he established and lead a MEMS Modelling Group. This was followed by a move in 1997 to the Albert Ludwig University in Freiburg, Germany. Currently, Dr. Korvink is a director of the School for Soft Matter Research, Freiburg Institute for Advanced Studies. He has written more that 180 journal and conference papers in the area of microsystem technology, and co-edits the review journal Applied Micro and Nanosystems, see http://www.wiley-vch.de/books/info/amn.

His research interests cover the computational design and low cost fabrication of microsystems, with a focus on applications in magnetic resonance.

 

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4 of 4 people found the following review helpful:
4.0 out of 5 stars A good book which covers recent technology in MEMs, March 16, 2001
By 
OZGUR YAVUZCETIN (Amherst, Massachusetts United States) - See all my reviews
This review is from: MEMS and MOEMS Technology and Applications (SPIE Press Monograph Vol. PM85) (Hardcover)
I had bought this book for one of my friends. He was an electrical engineer and I am a physicist. Normally because of the point of view of physicists and engineers, it is difficult to find a common expression in equations, derivations in these kind of books which can be understood by both majors. But this book is quite good for both. The expressions are clear and the reader can quickly have a good and strong concept about the chapters that are covered.

Thanks to the writer !

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Inside This Book (learn more)
Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
semiconductor wafer bonding, electronic packaging, optical lid, compatible pressure sensor, linear assembly motor, pressure sensor package, fluorosilicone gels, silicon oxinitride, pressure sensor devices, sacrificial layer removal, differential brightness, mil glass, direct wafer bonding, reacting silane, core ridge, packaging stress, die attach material, secondary diaphragms, cap wafer, micromachined pressure sensors, surface micromachined structures, sensor die, power limiter, anodic bonding, micromachined devices
Key Phrases - Capitalized Phrases (CAPs): (learn more)
International Conference, Sensors Actuators, New York, Analog Devices, Texas Instruments, San Diego, Lightwave Technol, Micro Electro Mechanical Systems, Electron Devices, Commercialization of Microsystems, Invited Paper, United States, International Symposium, University of California, Micromachine Devices, Harper Business Press, Digital Micromirror Device, Solid State Technology, Materials Research Society Symposium Proceedings, Selected Top, Delft University of Technology, Journal of Microelectromechanical Systems, Management of Innovation, Mirror Master, Display Technology
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Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
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