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Design for Manufacturability and Yield for Nano-Scale CMOS (Integrated Circuits and Systems)
 
 
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Design for Manufacturability and Yield for Nano-Scale CMOS (Integrated Circuits and Systems) [Hardcover]

Charles Chiang (Author), Jamil Kawa (Author)
4.0 out of 5 stars  See all reviews (1 customer review)

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Book Description

1402051875 978-1402051876 August 24, 2007 1
This book walks the reader through all the aspects of manufacturability and yield in a nano-CMOS process. It covers all CAD/CAE aspects of a SOC design flow and addresses a new topic (DFM/DFY) critical at 90 nm and beyond. This book is a must read book the serious practicing IC designer and an excellent primer for any graduate student intent on having a career in IC design or in EDA tool development.

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Editorial Reviews

From the Publisher

Written for:
ASIC/ SOC designers, EDA R&D engineers, professors and graduate students

Keywords:
-CAD (Computer aided design)
-CAE (Computer aided engineering)
-DFM (Design for manufacturability)
-DFY (Design for yield)
-SOC (System on a chip design)

From the Back Cover

As we approach the 32 nm CMOS technology node the design and manufacturing communities are dealing with a lithography system that has to print circuit artifacts that are significantly less than half the wavelength of the light source used, with new materials, with tighter pitches, and higher aspect ratio metallurgies. This reality has resulted in three main manufacturability issues that have to be addressed: printability, planarization, and intra-die variability. Addressing in depth the fundamentals impacting those three issues at all the stages of the design process is not a luxury one can ignore. Manufacturability and yield are now one and the same and are no longer a fabrication, packaging, and test concerns; they are the concern of the whole IC community. Yield and manufacturability have to be designed in, and they are everybody’s responsibility. Design for Manufacturability and Yield for Nano-Scale CMOS walks the reader through all the aspects of manufacturability and yield in a nano-CMOS process and how to address each aspect at the proper design step starting with the design and layout of standard cells and how to yield-grade libraries for critical area and lithography artifacts through place and route, CMP model based simulation and dummy-fill insertion, mask planning, simulation and manufacturing, and through statistical design and statistical timing closure of the design. It alerts the designer to the pitfalls to watch for and to the good practices that can enhance a design’s manufacturability and yield. This book is a must read book the serious practicing IC designer and an excellent primer for any graduate student intent on having a career in IC design or in EDA tool development.

Product Details

  • Hardcover: 281 pages
  • Publisher: Springer; 1 edition (August 24, 2007)
  • Language: English
  • ISBN-10: 1402051875
  • ISBN-13: 978-1402051876
  • Product Dimensions: 9.3 x 6 x 0.7 inches
  • Shipping Weight: 1.3 pounds (View shipping rates and policies)
  • Average Customer Review: 4.0 out of 5 stars  See all reviews (1 customer review)
  • Amazon Best Sellers Rank: #2,333,703 in Books (See Top 100 in Books)

 

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2 of 4 people found the following review helpful:
4.0 out of 5 stars Design for Yield, December 16, 2007
This review is from: Design for Manufacturability and Yield for Nano-Scale CMOS (Integrated Circuits and Systems) (Hardcover)
Design for Manufacturability and Yield for Nano-Scale CMOS (Series on Integrated Circuits and Systems)

This book provides a good overview of the challenges in IC design for manufacturing and yield optimization.
It covers all the advanced problems at 65nm and below such as random and systematic variability, CMP and statistical design analysis.
The book represents an useful introduction to those topics for students, engineers and technical managers in the microelectronics industry.
The drawbacks are:
- very poor graphical quality of pictures and diagrams
- lack of an index
- some missing of relevant industrial examples (devices, metrics, analysis results)
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Inside This Book (learn more)
Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
open critical area, final thickness range, defect size distribution function, yield scoring function, total critical area, shape expansion method, short critical area, average critical area, filter characteristic length, maximum nominal thickness, yield score function, critical area reductions, time related failures, dummy filling, effective density range, systematic yield, adaptive voltage scaling, critical area computation, wire widening, statistical timing analysis, range pattern matching, yield prediction model, digitized geometry, slicing direction, manufacturing grid
Key Phrases - Capitalized Phrases (CAPs): (learn more)
Model Based Dummy Filling, Improving Critical Area, Practical Application, Resolution Enhancement Technique, Monte Carlo, Full Chip Simulation Algorithm, Mathematical Formulation of Approximation Method, Integrating Equation, Lithography Figure, Yield Loss Sources
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