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Printed Circuit Board Materials Handbook (Electronic Packaging and Interconnection)
 
 
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Printed Circuit Board Materials Handbook (Electronic Packaging and Interconnection) [Hardcover]

Martin W. Jawitz (Author)
4.0 out of 5 stars  See all reviews (1 customer review)


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Book Description

0070324883 978-0070324886 May 1, 1997 1
Select PCB materials for top performing boards

From weaving glass fiber mats to testing finished boards, this one-stop materials database offers the first close-up look at how to process and fabricate world-class PCBs. Printed Circuit Board Materials Handbook gives you a complete, hands-on working knowledge of the electrical, mechanical and physical properties of PCB raw materials - plus the expertise to transform them into a high-performance printed circuit card. Packed with over 400 how-to illustrations, this encyclopedia tool gives you the know-how to:

  • Master the processes for glass fiber reinforcement, polyimide film, PET, PEN, and resins
  • Work with copper foils, anodes, prepreg and laminates, aramid mats, and drill bits and routers
  • Fabricate rigid and flexible printed wiring boards
  • Apply the latest coating, laminating, etching, and electroplating methods
  • Maximize techniques for hot air leveling, microsection analysis and electrical test
  • Resolve controversial cleaning issues and CFC problems plus conduct troublshooting and failure analysis
  • Much more


Editorial Reviews

From the Back Cover

Everything you need to know about printed circuit board fabrication--in one single source! This book covers the total PCB construction process from the first glob of glass to the finished board, giving you all the materials information you need to make your designs work. It goes into depth like no other book has before, describing how the basic raw materials are used to make various types of printed wiring boards along with their physical, mechanical, and electrical properties. Whether you're an electrical or mechanical engineer working with PCBs or a materials, processing, or manufacturing engineer, you'll find problem-solving guidelines to help you understand the materials and processes that go into making a reliably designed product. For example, design engineers who don't know the electrical properties or thickness of a material to use can turn to chapter 2 for details on properties of the material and material thickness and chapter 9 to find out how much material, preprep, and laminate is required. Or quality engineers who need to make sure they have a good reliable product can turn to chapters 31 and 32 for details on microsection analysis and electrical tests required to ensure a good product. And process engineers who need to make sure they have a good reliable product can turn to chapters 31 and 32 for details on microsection analysis and electrical tests required to ensure a good product. And process engineers whose plating solutions are not depositing the required thickness can see chapter 25 for a full description of plating bath make-up and chemical analysis procedures. Key features of the handbook include: full start-to-finish coverage of the PCB fabrication process; expert advice on controversial cleaning issues and CFC problems; practical sections on troubleshooting and failure analysis. It's a unique single-source reference on the products and processes used in making PCBs, jam-packed with practical information to help engineers understand how their designs are affected by the materials and processes they choose--making the difference between a slow, unreliable failure and a successful design.

About the Author

Martin W. Jawitz (Chatsworth, CA) has approximately 40 years in the Printed Wiring Board Industry. He is currently the senior editor of Flexible Circuits Engineering Magazine. Prior to that, Marty was employed by Jet Propulsion Labs in Pasadena, California, Litton Industries, Lockheed Electronics, and Singer Kearfott. He has published many articles in the trade press, chairs many IPC meetings, and has taught extensively in the PWB field.

Product Details

  • Hardcover: 784 pages
  • Publisher: McGraw-Hill Professional; 1 edition (May 1, 1997)
  • Language: English
  • ISBN-10: 0070324883
  • ISBN-13: 978-0070324886
  • Product Dimensions: 9.1 x 6.2 x 2.4 inches
  • Shipping Weight: 2.8 pounds
  • Average Customer Review: 4.0 out of 5 stars  See all reviews (1 customer review)
  • Amazon Best Sellers Rank: #694,190 in Books (See Top 100 in Books)

 

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1 of 14 people found the following review helpful:
4.0 out of 5 stars PCB, March 28, 2001
By 
Haris Leong (Penang,Malaysia) - See all my reviews
This review is from: Printed Circuit Board Materials Handbook (Electronic Packaging and Interconnection) (Hardcover)
Very usefull for those who like get more khowledge on related subject.
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Inside This Book (learn more)
First Sentence:
As shown in Table 1.1, during the 1930s and 1940s, the use of glass fibers advanced from research programs and laboratory prototypes to manufacturing reality. Read the first page
Key Phrases - Capitalized Phrases (CAPs): (learn more)
Graphic Research Inc, United States, Printed Circuit World Conference, Copper Foil Prepreg Copper Foil Caul, Filtration Continuous, New York, Polytetrafluoroethylene Glass, Advanced Plasma Systems, Agitation Mild, Allision Park, Carson City, Conventional Conventional, Electroless Panel, Filtration Voltage, Kollmorgan Corp, North American, Polyimide Butyral, Rice Goldman, Temperature Agitation Cathode, Apply Image Strip, Clean Reflow, Conical Tip Conical Tip, Dennis Vaughan, Develop Image Apply Panel Etch, Internal Layers Reinforced Laminate
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