RF Measurements of Die and Packages (Artech House Microwave Library) [Hardcover]

Scott A. Wartenberg (Author)

Book Description

ISBN-10: 158053273X | ISBN-13: 978-1580532730 | Publication Date: June 15, 2002 | Edition: 1st

Dedicated to the issues surrounding RFIC testing. An important resource for RFIC designers and high-frequency digital IC designers, IC test engineers, and IC manufacturing test engineers.

Product Details

• Hardcover: 272 pages
• Publisher: Artech Print on Demand; 1st edition (June 15, 2002)
• Language: English
• ISBN-10: 158053273X
• ISBN-13: 978-1580532730
• Product Dimensions: 9.3 x 6.4 x 0.8 inches
• Shipping Weight: 1.1 pounds (View shipping rates and policies)
• Average Customer Review: 3.4 out of 5 stars  See all reviews (5 customer reviews)
• Amazon Best Sellers Rank: #2,326,738 in Books (See Top 100 in Books)

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Customer Reviews

Most Helpful Customer Reviews

6 of 8 people found the following review helpful:

2.0 out of 5 stars Nice try, but a bit shallow, June 25, 2002

By A Customer

This review is from: RF Measurements of Die and Packages (Artech House Microwave Library) (Hardcover)

Microwave wafer probing has been around since the mid-80's and is relatively mature, with commercial products that satisfy most needs. This work attempts to summarize information from manufacturers' applications notes, trade magazines, and professional publications. It provides little (if any) original content. The greatest strength of this book is the extensive list of references.
The content was disappointing however. The book stays at the surface of the subject. When it occasionally attempts depth it is of questionable accuracy. Knowledgeable readers will identify minor quibbles to completely incorrect statements. There are also a few discussions that make no sense, use unusual/confusing terminology, or take the reader down a path to incorrect interpretations of the meaning.
The "packages" content seems to be an afterthought, in some sections the text is written solely as if the book was only about die measurements.
To summarize: This is a useful read even for experienced microwave probers, but read with caution. The content is not authoritative and should be verified prior to trusting.

2 of 3 people found the following review helpful:

4.0 out of 5 stars Valuable advice for RF test engineers, July 10, 2002

By A Customer

This review is from: RF Measurements of Die and Packages (Artech House Microwave Library) (Hardcover)

Those experienced in the microwave industry will tell you that RF testing is a very subtle art and highly sensitive to environment and test conditions. It is far from "mature" as one reviewer puts it. Greater complexity and integration in RF IC's are placing greater demand for complex probe design. It is for these reasons that there are few books that cover this area. Scott Wartenberg's book does a great job in addressing this complex field and offers valuable insight together with a wealth of real bench experience. The latter is very useful for young and seasoned engineers alike. You will find many "nuggets" of wisdom that would aid and correct your RF test methodology.

1 of 2 people found the following review helpful:

3.0 out of 5 stars Not enough, November 11, 2002

By A Customer

This review is from: RF Measurements of Die and Packages (Artech House Microwave Library) (Hardcover)

This is a fine book if you just want a general overview of RF probe. It lacks detail and in-depth coverage. You may find a few helpful things in it but it is far from being a great book on the subject.