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Mechanical Microsensors (Microtechnology and MEMS)
 
 
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Mechanical Microsensors (Microtechnology and MEMS) [Hardcover]

M. Elwenspoek (Author), R. Wiegerink (Author)

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Book Description

3540675825 978-3540675822 January 12, 2001 1
This book provides a comprehensive description of microsensors for mechanical quantities (flow, pressure, force, inertia) fabricated by silicon micromachining. Since the design of such sensors requires interdisciplinary teamwork, the presentation is made accessible to engineers trained in electrical and mechanical engineering, physics and chemistry. The reader is guided through the micromachining fabrication process. A chapter on microsensor packaging completes the discussion of technological problems. The description of the basic physics required for sensor design includes the mechanics of deformation and the piezoresistive transduction to electrical signals. There is also a comprehensive discussion of resonant sensors, the hydrodynamics and heat transfer relevant for flow sensors, and, finally, electronic interfacing and readout circuitry. Numerous up-to-date case studies are presented, together with the working, fabrication and design of the sensors.

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Editorial Reviews

Review

"Mechanical Microsensors provides a comprehensive description of the various design techniques required for silicon micromachining of sensors. This is a very well written book which has a pleasant balance of mathematical, physics and engineering principles, that make this book suitable for physicists, chemistry, electrical and mechanical engineers." --SENSOR REVIEW "Of particular value is the fact that the authors go further than the description of the silicon sensor elements and also present solutions on how to interface these sensors to the surrounding world - electronically in the chapter on 'Electronic Interfacing' as well as physically in the chapter on 'Packaging'. To summarize, this textbook gives a comprehensive overview of mechanical microsensors which is especially well suited for students in courses on mechanical microsensors, but is also valuable for people in research and industry with an interest in this exciting and growing field." -MEASUREMENT SCIENCE AND TECHNOLOGY

From the Back Cover

Fabrication technologies related to those which are exploited for the fabrication of integrated circuits can be used to machine mechanical structures with minimum feature sizes in the range of micrometers. The mechanical machining of silicon based on IC-technologies is known as micromachining, and the systems made by micromachining are called MEMS (microelectromechanical systems). The present book describes how to use this technology to fabricate sensors of miniature size for mechanical quantities, such as pressure, force, flow and acceleration. The book includes a chapter with a comprehensive description of the relevant micromachining processes, and an introduction to MEMS, a field much broader than just microsensors. Most of these sensors rely on a deformation of the mechanical construction by an external load, and on a transduction mechanism to convert the deformation into a mechanical signal. The fundamental mechanics and electromechanics required for the understanding and the design of mechanical microsensors are described on a level accessible to engineers of all disciplines. Students in engineering sciences from the third year on should be able to benefit from this description. The most important mechanical sensors are described and discussed in detail with respect to fabrication issues, function and performance. Special emphasis is given to pressure sensors, force sensors, accelerometers, gyroscopes and flow sensors. Electronic interfacing, and a discussion of electronic circuits used for the sensors is also included. Finally the problem of packaging is addressed.

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Inside This Book (learn more)
First Sentence:
The use of silicon microsensors for pressure, acceleration, angular rate and fluid flow is increasing at high rates since micromachining has become a more or less mature technology. Read the first page
Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
calorimetric flow sensors, skin friction sensors, load cell chip, pressure imager, wafer bonding step, large proof mass, beam force sensor, thermal flow sensors, electrothermal excitation, resonant strain gauges, mechanical microsensors, deflecting membrane, sensor wafer, silicon microphones, accelerometer structure, resonant sensors, resonant pressure sensor, capacitive pressure sensor, wafer package, electrostatic excitation, sensor die, support wafer, silicon fusion bonding, shear stress sensors, bridge output voltage
Key Phrases - Capitalized Phrases (CAPs): (learn more)
Cambridge University Press, Analog Devices, Principles of Measuring Mechanical Quantities, The Laminar Boundary Layer
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