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Microchip Fabrication: A Practical Guide to Semiconductor Processing
 
 
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Microchip Fabrication: A Practical Guide to Semiconductor Processing [Hardcover]

Peter Van Zant (Author), Peter Van Zant (Author)
3.7 out of 5 stars  See all reviews (16 customer reviews)


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Hardcover, October 1996 --  
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Microchip Fabrication, 5th Ed. Microchip Fabrication, 5th Ed. 3.7 out of 5 stars (16)
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Book Description

0070672504 978-0070672505 October 1996 3rd
s an easy-to-follow introduction to semiconductor fabrication that proceeds from basic materials and process chemicals to chip packaging procedures. New methods and data related to packaging, memory circuits, and semiconductor devices are key updates in this new edition.


Editorial Reviews

From the Back Cover

A nontechnical, understandable guide to microchip fabrication, from semiconductor material preparation to the finished device This one-stop guide covers the entire process of microchip fabrication, from semiconductor material preparation to shipment of the finished and packaged device, using a plain-English, low-math approach that avoids complex engineering theory. The new Third Edition details all the current issues, science, processes and materials involved. It proceeds from basic materials and process chemicals to chip packaging procedures, with more than 500 drawings and figures to make the material crystal clear. The latest methods and data related to packaging, memory circuits, and semiconductor devices are presented in complete detail. The guide fully covers both established procedures and fabrication of state-of-the-art ULSI circuits. Plus, it covers vital supporting technologies such as crystal growth and contamination control of clean rooms. You'll find the latest material on such topics as photolithography processes for submicron images, chemical mechanical polishing (CMP) for planarization, and use of minienvironments for contamination control. For anyone involved in semiconductor operations, marketing, quality control, training, education, or technical services, this easy-to-use guide is basic equipment.

About the Author

Peter Van Zant is an internationally known semiconductor professional with an extensive background in process engineering, training, consulting, and writing. Principal of Peter Van Zant Associates, a firm that supplies writing, training, and consulting services to business and industry, he is the author of Semiconductor Technology Glossary, Third Edition; Integrated Circuits Text; Safety First Manual; and Chip Packaging Manual. His books and training materials are used by chip manufacturers, industry suppliers, colleges, and universities. Peter Van Zant Associates' customers include Intel, National Semiconductor, Applied Materials, Air Products and Chemicals, SCP Global Inc., and a number of educational institutions. Mr. Van Zant is also the elected District 1 Supervisor in his home county of Nevada in California. --This text refers to an alternate Hardcover edition.

Product Details

  • Hardcover: 623 pages
  • Publisher: Semiconductor Services; 3rd edition (October 1996)
  • Language: English
  • ISBN-10: 0070672504
  • ISBN-13: 978-0070672505
  • Product Dimensions: 9.2 x 6.1 x 1.7 inches
  • Shipping Weight: 2.3 pounds
  • Average Customer Review: 3.7 out of 5 stars  See all reviews (16 customer reviews)
  • Amazon Best Sellers Rank: #1,744,542 in Books (See Top 100 in Books)

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Customer Reviews

16 Reviews
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Average Customer Review
3.7 out of 5 stars (16 customer reviews)
 
 
 
 
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Most Helpful Customer Reviews

19 of 21 people found the following review helpful:
5.0 out of 5 stars a reader, May 3, 2000
By A Customer
I read two previous editions of this book. When I heard the 4th edition, I cannot wait to buy one. This book is written so well that it's good for readers from inside and outside of the industry. The coverage of the new development of technology is especially useful. I also like chapter 15 very much. The author discusses the business aspects of wafer fabrication, which is not seen very many times in a tech book. The author really knows what a reader would like to learn, opposing to that a lot authors only write for themseles. It is an excellent book.
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11 of 11 people found the following review helpful:
4.0 out of 5 stars Chip Fabrication 101, August 30, 2000
By A Customer
This is an excellent book for someone who knows little about semiconductors. It goes into historical and current wafer processing trends and discusses a few of the challenges for future techonolgy nodes. The book touches on most parts of fabrication and presents simplified versions of the theory and equipment involved. Not for advanced readers.
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19 of 22 people found the following review helpful:
3.0 out of 5 stars Poorly written, poorly edited, but you still have to read it, August 6, 2000
By 
JB (One Cave in the Afghanistan Rain Forest) - See all my reviews
English is not my first language, I still find this book painful to read. It took me a weekend to munch down the top one third of this book, a biography of Seymour Cray, and six Japanese comic books. I find this book among them, the worst prepared one.

With so many errors in it, I kept grabbing my hair. Many mistakes are so easy to spot, I can usually randomly filp over ten pages, and spot an error. Many of them are really serious, they really can mislead a student, if he/she lacked proper training in science. Say on one page, ozone was mistakenly printed as O2 rather than O3. There are some other unbalanced chemical formula as well. Some math formula are also poorly written or presented.

Read it, but be careful. It can be a mine field.

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Inside This Book (learn more)
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First Sentence:
In this chapter, you will be introduced to the Semiconductor industry via a brief history, as well as by the importance of the industry in the world economy, an overview of the significant technical developments, and the trends that have made the industry the world's leading industrial segment. Read the first page
Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
preseal inspection, wafer sort yield, mobile ionic contaminants, photomasking process, incomplete etch, exposed wafer surface, aligner tool, mobile ionic contamination, cum yield, patterning operation, fab area, develop inspect, layering operation, doping operation, fab yield, functioning die, larger diameter wafers, wafer boat, proximity aligners, gowning area, more process steps, wafer breakage, dopant concentration profile, wafer thinning, horizontal tube furnaces
Key Phrases - Capitalized Phrases (CAPs): (learn more)
Semiconductor International, Cahners Publishing, Publishing Company, Review Questions, Objectives Upon, New York, Fabrication Principles, Lattice Press, Semiconductor Industry Association, Sunset Beach, John Wiley, Resist Oxide, Semiconductor Services, Bell Labs, San Jose, Federal Standard, Integrated Circuit Fabrication Technology, Perkin Elmer, Van Nostrand Reinhold, Hybrid Microcircuit Technology Handbook, Noyes Publications, Year of Production, Book Company, Chemical Mechanical Planarization of Microelectronic Materials, Copper Goes Mainstream
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